Inventor · disambiguated record
Daniel Rosales-Yeomans
Also filed as: ROSALES-YEOMANS DANIEL
0 granted patents·4 pending applications·0 citations·filing 2022–2023
Files withINTEL CORP4
Top patents by PatentIndex Score
4 records- 0153US2025192059A1Embedded bridge with through silicon via bonding architecturesINTEL CORP·Filed 2023·Application pending·0 cites
- 0250US2025112140A1Stress mitigation architectures for glass core substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 0342US2024203664A1In core large area capacitorsINTEL CORP·Filed 2022·Application pending·0 cites
- 0441US2024153857A1High aspect ratio tgv substrates through direct hybrid bonding of thin tgv substratesINTEL CORP·Filed 2022·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Daniel Rosales-Yeomans files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →