Inventor · disambiguated record
Daisuke Sakurai
Also filed as: SAKURAI DAISUKE
47 granted patents·11 pending applications·247 citations·filing 2002–2025
97Inventor score
Files withSAKURAI DAISUKE12PANASONIC IP MAN CO LTD9KUBOTA KK8PANASONIC CORP8MATSUSHITA ELECTRIC INDUSTRIAL CO LTD7
Top patents by PatentIndex Score
58 records- 0196US10308108B2Working machineKUBOTA KK·Filed 2016·Granted Jun 4, 2019·11 cites·20 claims
- 0295US7229293B2Connecting structure of circuit board and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Jun 12, 2007·58 cites·10 claims
- 0394US7768795B2Electronic circuit device, electronic device using the same, and method for manufacturing the samePANASONIC CORP·Filed 2005·Granted Aug 3, 2010·33 cites·16 claims
- 0491US7775446B2Card type information device and method for manufacturing samePANASONIC CORP·Filed 2007·Granted Aug 17, 2010·31 cites·11 claims
- 0585US8018731B2Interconnect substrate and electronic circuit mounted structurePANASONIC CORP·Filed 2007·Granted Sep 13, 2011·13 cites·5 claims
- 0684US8450848B2Semiconductor device and method for fabricating the sameSAKURAI DAISUKE·Filed 2010·Granted May 28, 2013·8 cites·7 claims
- 0783US8575751B2Conductive bump, method for producing the same, and electronic component mounted structureSAKURAI DAISUKE·Filed 2008·Granted Nov 5, 2013·6 cites·9 claims
- 0882US8922011B2Mounting structure of electronic component with joining portions and method of manufacturing the samePANASONIC CORP·Filed 2013·Granted Dec 30, 2014·7 cites·10 claims
- 0981US8367539B2Semiconductor device and semiconductor device manufacturing methodPANASONIC CORP·Filed 2011·Granted Feb 5, 2013·6 cites·12 claims
- 1080US8120188B2Electronic component mounting structure and method for manufacturing the sameSAKURAI DAISUKE·Filed 2007·Granted Feb 21, 2012·8 cites·10 claims
- 1179US8134081B2Three-dimensional circuit board and its manufacturing methodSAKURAI DAISUKE·Filed 2007·Granted Mar 13, 2012·7 cites·7 claims
- 1278US9331042B2Semiconductor device manufacturing method and semiconductor devicePANASONIC CORP·Filed 2012·Granted May 3, 2016·6 cites·12 claims
- 1377US9238278B2Solder transfer substrate, manufacturing method of solder transfer substrate, and solder transfer methodSAKURAI DAISUKE·Filed 2012·Granted Jan 19, 2016·4 cites·6 claims
- 1474US11634024B2Working machineKUBOTA KK·Filed 2022·Granted Apr 25, 2023·0 cites·9 claims
- 1573US10704232B2Hydraulic system for working machineKUBOTA KK·Filed 2017·Granted Jul 7, 2020·3 cites·11 claims
- 1672US11273703B2Working machineKUBOTA KK·Filed 2020·Granted Mar 15, 2022·0 cites·46 claims
- 1771US8119449B2Method of manufacturing an electronic part mounting structureSAKURAI DAISUKE·Filed 2007·Granted Feb 21, 2012·5 cites·4 claims
- 1870US11306746B2Hydraulic system for working machineKUBOTA KK·Filed 2020·Granted Apr 19, 2022·0 cites·12 claims
- 1970US8083150B2Noncontact information storage medium and method for manufacturing sameSAKURAI DAISUKE·Filed 2006·Granted Dec 27, 2011·8 cites·6 claims
- 2067US7928566B2Conductive bump, method for manufacturing the conductive bump, semiconductor device and method for manufacturing the semiconductor devicePANASONIC CORP·Filed 2007·Granted Apr 19, 2011·3 cites·15 claims
- 2167US2025389907A1Method for producing optical module, and optical modulePANASONIC IP MAN CO LTD·Filed 2025·Application pending·0 cites
- 2265US7375421B2High density multilayer circuit moduleMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted May 20, 2008·3 cites·7 claims
- 2364US11725364B2Hydraulic system of working machineKUBOTA KK·Filed 2022·Granted Aug 15, 2023·0 cites·12 claims
- 2464US7176055B2Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Feb 13, 2007·10 cites·26 claims
- 2563US10341270B2Providing enhanced application interoperabilityCITRIX SYSTEMS INC·Filed 2014·Granted Jul 2, 2019·2 cites·20 claims
- 2663US2024387444A1Flip-chip mounting structure and flip-chip mounting methodPANASONIC IP MAN CO LTD·Filed 2024·Application pending·0 cites
- 2759US10703195B2Working machineKUBOTA KK·Filed 2019·Granted Jul 7, 2020·0 cites·39 claims
- 2859US7297876B2Circuit board and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Nov 20, 2007·8 cites·6 claims
- 2959US2024332234A1Bump manufacturing method and imprint die used in samePANASONIC IP MAN CO LTD·Filed 2024·Application pending·0 cites
- 3058US11010032B2Navigating a hierarchical data setCITRIX SYSTEMS INC·Filed 2014·Granted May 18, 2021·1 cites·21 claims
- 3158US2025244283A1Sensor element and gas sensorNITERRA CO LTD·Filed 2025·Application pending·0 cites
- 3257US2025286005A1Semiconductor device, and manufacturing method for samePANASONIC IP MAN CO LTD·Filed 2025·Application pending·0 cites
- 3356US11810927B2Solid-state imaging apparatus including semiconductor element with photoelectric converter and strain sensorsPANASONIC IP MAN CO LTD·Filed 2021·Granted Nov 7, 2023·0 cites·7 claims
- 3452US10774852B2Hydraulic system for working machineKUBOTA KK·Filed 2017·Granted Sep 15, 2020·0 cites·16 claims
- 3551US8809693B2Three-dimensional circuit boardSAKURAI DAISUKE·Filed 2012·Granted Aug 19, 2014·0 cites·21 claims
- 3650US11145585B2Wiring board having each pad with tapered section continuously formed on columnar sectionSHINKO ELECTRIC IND CO·Filed 2020·Granted Oct 12, 2021·0 cites·17 claims
- 3749US11480197B2Ejector moduleDENSO CORP·Filed 2019·Granted Oct 25, 2022·0 cites·20 claims
- 3849US7233069B2Interconnection substrate and fabrication method thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jun 19, 2007·2 cites·20 claims
- 3948US10365446B2Optical module structurePANASONIC IP MAN CO LTD·Filed 2018·Granted Jul 30, 2019·0 cites·9 claims
- 4048US7353600B2Circuit board fabrication method and circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Apr 8, 2008·2 cites·5 claims
- 4148US2009246474A1Electronic component mounted structure and method of manufacturing the samePANASONIC CORP·Filed 2009·Application pending·0 cites
- 4247US11908785B2Semiconductor device and methods of manufacturing semiconductor devicePANASONIC IP MAN CO LTD·Filed 2021·Granted Feb 20, 2024·0 cites·17 claims
- 4347US7084008B2Manufacturing method for electronic component-mounted component, manufacturing method for electronic component-mounted completed product with the electronic component-mounted component, and electronic component-mounted completed productMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Aug 1, 2006·2 cites·12 claims
- 4447US2006177846A1Method and apparatus for design and display of primersHITACHI SOFTWARE ENG·Filed 2005·Application pending·0 cites
- 4546US10790250B2Method for manufacturing semiconductor devicePANASONIC IP MAN CO LTD·Filed 2018·Granted Sep 29, 2020·0 cites·13 claims
- 4645US11530854B2Ejector refrigeration cycleDENSO CORP·Filed 2020·Granted Dec 20, 2022·0 cites·5 claims
- 4744US2015113436A1Providing Enhanced Message Management User InterfacesCITRIX SYSTEMS INC·Filed 2014·Application pending·0 cites
- 4843US9665263B2Snap navigation of a scrollable listCITRIX SYSTEMS INC·Filed 2014·Granted May 30, 2017·0 cites·18 claims
- 4942US8742584B2Semiconductor deviceSAKURAI DAISUKE·Filed 2012·Granted Jun 3, 2014·0 cites·17 claims
- 5042US2005221353A1Data processing and display method for gene expression analysis system and gene expression analysis systemHITACHI SOFTWARE ENG·Filed 2005·Application pending·0 cites
Showing the top 50 of 58 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →