Inventor · disambiguated record
Dai Sasaki
Also filed as: SASAKI DAI
53 granted patents·26 pending applications·322 citations·filing 1999–2025
98Inventor score
Files withSUMITOMO ELECTRIC INDUSTRIES34ELPIDA MEMORY INC11SONY COMPUTER ENTERTAINMENT INC7SONY CORP5MICRON TECHNOLOGY INC3
Top patents by PatentIndex Score
79 records- 0198US10115709B1Apparatuses comprising semiconductor dies in face-to-face arrangementsMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 30, 2018·23 cites·18 claims
- 0295US9606300B2Adapter and optical connector coupling systemSUMITOMO ELECTRIC INDUSTRIES·Filed 2015·Granted Mar 28, 2017·22 cites·9 claims
- 0392US9360632B2FerruleSUMITOMO ELECTRIC INDUSTRIES·Filed 2015·Granted Jun 7, 2016·10 cites·8 claims
- 0492US7619386B2Battery pack, charging control method, and application deviceSONY CORP·Filed 2005·Granted Nov 17, 2009·44 cites·9 claims
- 0591US9551835B2Grin lens array, lens-mounted connector, and lens-mounted connector systemSUMITOMO ELECTRIC INDUSTRIES·Filed 2015·Granted Jan 24, 2017·10 cites·16 claims
- 0690US8727634B2Optical connector, optical connecting structure and method of manufacturing optical connectorSASAKI DAI·Filed 2012·Granted May 20, 2014·13 cites·15 claims
- 0789US7300302B2AC adapter with heat radiation sheetMITSUMI ELECTRIC CO LTD·Filed 2006·Granted Nov 27, 2007·25 cites·8 claims
- 0888US8243465B2Semiconductor device with additional power supply pathsITAYA SATOSHI·Filed 2010·Granted Aug 14, 2012·13 cites·15 claims
- 0985US7777350B2Semiconductor stack package having wiring extension part which has hole for wiringELPIDA MEMORY INC·Filed 2008·Granted Aug 17, 2010·13 cites·18 claims
- 1084US9418967B2Semiconductor devicePS4 LUXCO SARL·Filed 2013·Granted Aug 16, 2016·7 cites·6 claims
- 1183USD1036389SOptical fiber connectorSUMITOMO ELECTRIC INDUSTRIES·Filed 2022·Granted Jul 23, 2024·6 cites·1 claims
- 1282US9618705B2Receptacle connectorSUMITOMO ELECTRIC INDUSTRIES·Filed 2015·Granted Apr 11, 2017·4 cites·9 claims
- 1382US7564214B2Battery pack, charging control method, and application deviceSONY CORP·Filed 2005·Granted Jul 21, 2009·17 cites·10 claims
- 1478US11638349B2Metal-clad laminate and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Granted Apr 25, 2023·1 cites·19 claims
- 1577USD1038038SOptical fiber connectorSUMITOMO ELECTRIC INDUSTRIES·Filed 2022·Granted Aug 6, 2024·4 cites·1 claims
- 1676US7949872B2Battery and authentication requesting deviceSONY COMPUTER ENTERTAINMENT INC·Filed 2009·Granted May 24, 2011·5 cites·6 claims
- 1776US7617395B2Battery and authentication requesting deviceSONY COMPUTER ENTERTAINMENT INC·Filed 2005·Granted Nov 10, 2009·12 cites·8 claims
- 1872US11137554B2Optical connection structureSUMITOMO ELECTRIC INDUSTRIES·Filed 2018·Granted Oct 5, 2021·2 cites·19 claims
- 1971US6612024B1Method of mounting a device to a mounting substrateSONY CORP·Filed 2000·Granted Sep 2, 2003·17 cites·4 claims
- 2070US6816975B1Status display for temperature regulation of processing unit using LEDs of different colorSONY COMPUTER ENTERTAINMENT INC·Filed 2000·Granted Nov 9, 2004·16 cites·5 claims
- 2169US6977812B2Control method of cooling fan, and information processing deviceSONY COMPUTER ENTERTAINMENT INC·Filed 2003·Granted Dec 20, 2005·12 cites·4 claims
- 2268US2025138256A1Optical apparatus, light emitting apparatus, optical cable, and method of connecting optical apparatusSUMITOMO ELECTRIC INDUSTRIES·Filed 2025·Application pending·0 cites
- 2367US8569898B2Semiconductor deviceTAKEDA HIROMASA·Filed 2010·Granted Oct 29, 2013·2 cites·16 claims
- 2467US8372693B2Semiconductor device including semiconductor chips with different thicknessELPIDA MEMORY INC·Filed 2012·Granted Feb 12, 2013·2 cites·20 claims
- 2566US6587337B2Control method of cooling fan, and information processing deviceSONY COMPUTER ENTERTAINMENT INC·Filed 2001·Granted Jul 1, 2003·10 cites·4 claims
- 2665US12222562B2Optical apparatus, light emitting apparatus, optical cable, and method of connecting optical apparatusSUMITOMO ELECTRIC INDUSTRIES·Filed 2021·Granted Feb 11, 2025·0 cites·10 claims
- 2765US8581417B2Semiconductor device stack with bonding layer and wire retaining memberHASEGAWA YU·Filed 2010·Granted Nov 12, 2013·2 cites·19 claims
- 2864US6549715B1Method for estimating available record time and a recording medium processing apparatusSONY CORP·Filed 1999·Granted Apr 15, 2003·16 cites·40 claims
- 2963US8970052B2Semiconductor device stack with bonding layer and wire retaining memberPS4 LUXCO SARL·Filed 2013·Granted Mar 3, 2015·1 cites·20 claims
- 3063US7566874B2Infrared sensor and its manufacturing methodMURATA MANUFACTURING CO·Filed 2007·Granted Jul 28, 2009·3 cites·7 claims
- 3162US10600762B2Apparatuses comprising semiconductor dies in face-to-face arrangementsMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 24, 2020·0 cites·8 claims
- 3262US9291784B2Sealing component, optical device sealing structure, method for producing sealing component, and method for producing optical device sealing structureSUMITOMO ELECTRIC INDUSTRIES·Filed 2014·Granted Mar 22, 2016·1 cites·9 claims
- 3361US7512770B2Buffering apparatus and buffering method using ring bufferSONY COMPUTER ENTERTAINMENT INC·Filed 2005·Granted Mar 31, 2009·2 cites·13 claims
- 3458US10431566B2Apparatuses comprising semiconductor dies in face-to-face arrangementsMICRON TECHNOLOGY INC·Filed 2018·Granted Oct 1, 2019·0 cites·12 claims
- 3556US2025147243A1Optical connection structure, first connection body, first optical connector, second connection body, second optical connector, and method for manufacturing optical connection structureSUMITOMO ELECTRIC INDUSTRIES·Filed 2023·Application pending·0 cites
- 3656US2014219611A1Optical connector, optical connecting structure and method of manufacturing optical connectorSUMITOMO ELECTRIC INDUSTRIES·Filed 2014·Application pending·0 cites
- 3753US8378507B2Semiconductor device and method of bonding wires between semiconductor chip and wiring substrateELPIDA MEMORY INC·Filed 2009·Granted Feb 19, 2013·1 cites·10 claims
- 3853US2010224984A1Semiconductor device and stacked semiconductor device in which circuit board and semiconductor chip are connected by leadsELPIDA MEMORY INC·Filed 2009·Application pending·0 cites
- 3952US12248186B2Optical connector jig, optical connector connection method, and optical connector disconnection methodSUMITOMO ELECTRIC INDUSTRIES·Filed 2021·Granted Mar 11, 2025·0 cites·9 claims
- 4052US8796077B2Semiconductor deviceELPIDA MEMORY INC·Filed 2013·Granted Aug 5, 2014·0 cites·16 claims
- 4152US8513803B2Semiconductor device and stacked semiconductor deviceELPIDA MEMORY INC·Filed 2012·Granted Aug 20, 2013·0 cites·20 claims
- 4252US2023155461A1Conductor forming device and method of manufacturing wave winding coilHONDA MOTOR CO LTD·Filed 2022·Application pending·0 cites
- 4350USD1092407SOptical fiber connectorSUMITOMO ELECTRIC INDUSTRIES·Filed 2024·Granted Sep 9, 2025·0 cites·1 claims
- 4450USD1092408SOptical fiber connectorSUMITOMO ELECTRIC INDUSTRIES·Filed 2024·Granted Sep 9, 2025·0 cites·1 claims
- 4549US12483550B2Authentication systemTOYOTA MOTOR CO LTD·Filed 2022·Granted Nov 25, 2025·0 cites·6 claims
- 4649US2008185717A1Semiconductor device including bump electrodesELPIDA MEMORY INC·Filed 2008·Application pending·0 cites
- 4748US2023350134A1Optical apparatus, optical connector, and method for manufacturing optical apparatusSUMITOMO ELECTRIC INDUSTRIES·Filed 2021·Application pending·0 cites
- 4847US11280964B2Fusion splicer and method for fusion-splicing optical fibersSUMITOMO ELECTRIC INDUSTRIES·Filed 2019·Granted Mar 22, 2022·0 cites·19 claims
- 4947US11150418B2Optical connector ferrule and optical connectorSUMITOMO ELECTRIC INDUSTRIES·Filed 2020·Granted Oct 19, 2021·0 cites·6 claims
- 5047USD881814SOptical fiber connectorSUMITOMO ELECTRIC INDUSTRIES·Filed 2018·Granted Apr 21, 2020·4 cites·1 claims
Showing the top 50 of 79 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →