Inventor · disambiguated record
Da-Yuan Shih
Also filed as: SHIH DA Y · SHIH DA-YUAN
119 granted patents·73 pending applications·7,222 citations·filing 1986–2020
99Inventor score
Files withIBM131TAIWAN SEMICONDUCTOR MFG CO LTD8BEAMAN BRIAN S6BEAMAN BRIAN SAMUEL5BUCHWALTER STEPHEN LESLIE4
Top patents by PatentIndex Score
192 records- 0199US6708403B2Angled flying lead wire bonding processIBM·Filed 2003·Granted Mar 23, 2004·194 cites·31 claims
- 0299US6526655B2Angled flying lead wire bonding processIBM·Filed 2001·Granted Mar 4, 2003·188 cites·26 claims
- 0399US6334247B1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 1997·Granted Jan 1, 2002·277 cites·80 claims
- 0499US5821763ATest probe for high density integrated circuits, methods of fabrication thereof and methods of use thereofIBM·Filed 1996·Granted Oct 13, 1998·349 cites·13 claims
- 0599US5635846ATest probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformerIBM·Filed 1993·Granted Jun 3, 1997·342 cites·7 claims
- 0699US5371654AThree dimensional high performance interconnection packageIBM·Filed 1992·Granted Dec 6, 1994·503 cites·25 claims
- 0798US9679882B2Method of multi-chip wafer level packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 13, 2017·20 cites·20 claims
- 0898US7978473B2Cooling apparatus with cold plate formed in situ on a surface to be cooledIBM·Filed 2010·Granted Jul 12, 2011·68 cites·20 claims
- 0998US6300780B1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 1998·Granted Oct 9, 2001·197 cites·17 claims
- 1098US6206273B1Structures and processes to create a desired probetip contact geometry on a wafer test probeIBM·Filed 1999·Granted Mar 27, 2001·206 cites·9 claims
- 1198US5700844AProcess for making a foamed polymerIBM·Filed 1996·Granted Dec 23, 1997·186 cites·4 claims
- 1298US5531022AMethod of forming a three dimensional high performance interconnection packageIBM·Filed 1994·Granted Jul 2, 1996·328 cites·15 claims
- 1397US9082763B2Joint structure for substrates and methods of formingYU CHEN-HUA·Filed 2012·Granted Jul 14, 2015·37 cites·22 claims
- 1497US8754514B2Multi-chip wafer level packageYU CHUN HUI·Filed 2011·Granted Jun 17, 2014·107 cites·20 claims
- 1597US8476770B2Apparatus and methods for forming through viasSHAO TUNG-LIANG·Filed 2011·Granted Jul 2, 2013·58 cites·14 claims
- 1697US7495342B2Angled flying lead wire bonding processIBM·Filed 2003·Granted Feb 24, 2009·109 cites·29 claims
- 1797US6332270B2Method of making high density integral test probeIBM·Filed 1998·Granted Dec 25, 2001·231 cites·12 claims
- 1897US6295729B1Angled flying lead wire bonding processIBM·Filed 1998·Granted Oct 2, 2001·206 cites·8 claims
- 1997US6062879AHigh density test probe with rigid surface structureIBM·Filed 1998·Granted May 16, 2000·150 cites·7 claims
- 2097US5931222AAdhesion promoting layer for bonding polymeric adhesive to metal and a heat sink assembly using sameIBM·Filed 1997·Granted Aug 3, 1999·150 cites·13 claims
- 2197US5810607AInterconnector with contact pads having enhanced durabilityIBM·Filed 1995·Granted Sep 22, 1998·244 cites·18 claims
- 2297US5804607AProcess for making a foamed elastomeric polymerIBM·Filed 1997·Granted Sep 8, 1998·144 cites·8 claims
- 2397US5785538AHigh density test probe with rigid surface structureIBM·Filed 1996·Granted Jul 28, 1998·147 cites·17 claims
- 2497US5726211AProcess for making a foamed elastometric polymerIBM·Filed 1996·Granted Mar 10, 1998·151 cites·8 claims
- 2596US7538565B1High density integrated circuit apparatus, test probe and methods of use thereofIBM·Filed 1999·Granted May 26, 2009·112 cites·40 claims
- 2696US5756021AElectronic devices comprising dielectric foamed polymersIBM·Filed 1996·Granted May 26, 1998·108 cites·7 claims
- 2795US8669137B2Copper post solder bumps on substrateNAH JAE-WOONG·Filed 2011·Granted Mar 11, 2014·33 cites·11 claims
- 2895US7731079B2Cooling apparatus and method of fabrication thereof with a cold plate formed in situ on a surface to be cooledIBM·Filed 2008·Granted Jun 8, 2010·31 cites·9 claims
- 2995US6722032B2Method of forming a structure for electronic devices contact locationsIBM·Filed 2001·Granted Apr 20, 2004·79 cites·16 claims
- 3095US6528984B2Integrated compliant probe for wafer level test and burn-inIBM·Filed 1997·Granted Mar 4, 2003·178 cites·12 claims
- 3195US6054651AFoamed elastomers for wafer probing applications and interposer connectorsIBM·Filed 1996·Granted Apr 25, 2000·128 cites·7 claims
- 3294US7399421B2Injection molded microopticsIBM·Filed 2005·Granted Jul 15, 2008·25 cites·20 claims
- 3394US6329827B1High density cantilevered probe for electronic devicesIBM·Filed 1998·Granted Dec 11, 2001·107 cites·22 claims
- 3494US5433631AFlex circuit card elastomeric cable connector assemblyIBM·Filed 1994·Granted Jul 18, 1995·85 cites·5 claims
- 3593US7348270B1Techniques for forming interconnectsIBM·Filed 2007·Granted Mar 25, 2008·23 cites·22 claims
- 3693US6805974B2Lead-free tin-silver-copper alloy solder compositionIBM·Filed 2002·Granted Oct 19, 2004·59 cites·73 claims
- 3793US6452406B1Probe structure having a plurality of discrete insulated probe tipsIBM·Filed 1997·Granted Sep 17, 2002·111 cites·28 claims
- 3893US6286208B1Interconnector with contact pads having enhanced durabilityIBM·Filed 1996·Granted Sep 11, 2001·124 cites·5 claims
- 3993US6078500APluggable chip scale packageIBM·Filed 1998·Granted Jun 20, 2000·149 cites·6 claims
- 4092US7838954B2Semiconductor structure with solder bumpsIBM·Filed 2008·Granted Nov 23, 2010·24 cites·16 claims
- 4192US5914614AHigh density cantilevered probe for electronic devicesIBM·Filed 1997·Granted Jun 22, 1999·130 cites·8 claims
- 4291US8156998B2Patterned metal thermal interfaceFURMAN BRUCE K·Filed 2010·Granted Apr 17, 2012·12 cites·18 claims
- 4391US7786001B2Electrical interconnect structure and methodIBM·Filed 2007·Granted Aug 31, 2010·16 cites·9 claims
- 4491US7002247B2Thermal interposer for thermal management of semiconductor devicesIBM·Filed 2004·Granted Feb 21, 2006·65 cites·30 claims
- 4591US6104201AMethod and apparatus for passive characterization of semiconductor substrates subjected to high energy (MEV) ion implementation using high-injection surface photovoltageIBM·Filed 1998·Granted Aug 15, 2000·82 cites·10 claims
- 4690US9490408B2Injection molded microopticsIBM·Filed 2013·Granted Nov 8, 2016·4 cites·11 claims
- 4790US8877556B2Copper post solder bumps on substratesIBM·Filed 2013·Granted Nov 4, 2014·7 cites·5 claims
- 4890US7694719B2Patterned metal thermal interfaceIBM·Filed 2007·Granted Apr 13, 2010·18 cites·16 claims
- 4990US7368924B2Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereofIBM·Filed 2002·Granted May 6, 2008·34 cites·47 claims
- 5090US7180179B2Thermal interposer for thermal management of semiconductor devicesIBM·Filed 2004·Granted Feb 20, 2007·60 cites·19 claims
Showing the top 50 of 192 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →