Inventor · disambiguated record
Daisuke Shimokawa
Also filed as: SHIMOKAWA DAISUKE
5 granted patents·19 pending applications·26 citations·filing 2005–2019
71Inventor score
Top patents by PatentIndex Score
24 records- 0187US7635516B2Heat-peelable pressure-sensitive adhesive sheet and method for processing adherend using the heat-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2005·Granted Dec 22, 2009·17 cites·11 claims
- 0280US7641760B2Method of thermal adherend release and apparatus for thermal adherend releaseNITTO DENKO CORP·Filed 2005·Granted Jan 5, 2010·9 cites·11 claims
- 0356US2010119757A1Heat-peelable double-sided pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2008·Application pending·0 cites
- 0456US2010119816A1Heat-peelabe pressure-sensitive adhesive sheet containing layered silicate and process for the production for electronic components by the use of the sheetNITTO DENKO CORP·Filed 2008·Application pending·0 cites
- 0552US12087924B2Gas adsorption sheet for secondary batteriesNITTO DENKO CORP·Filed 2019·Granted Sep 10, 2024·0 cites·2 claims
- 0652US2010021668A1Double-sided pressure-sensitive adhesive sheet and liquid-crystal displayNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 0749US2008038540A1Adhesive sheet, process for producing the same, and method of cutting multilayered ceramic sheetNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 0845US2010215882A1Heat-peelable pressure-sensitive adhesive sheet for cutting laminated ceramic sheet and method for cut-processing laminated ceramic sheetNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 0944US11302976B2Pressure-sensitive adhesive tape for battery outer packagingNITTO DENKO CORP·Filed 2017·Granted Apr 12, 2022·0 cites·6 claims
- 1044US2011200744A1Adhesive sheet, process for producing the same, and method of cutting multilayered ceramic sheetNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 1143US2010119791A1Heat-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2008·Application pending·0 cites
- 1243US2011094675A1Electronic paper manufacturing method and double-sided adhesive tape for electronic paper formation processNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 1340US2016260937A1Covering material-provided non-aqueous secondary cell, producing method thereof, and cell stackNITTO DENKO CORP·Filed 2016·Application pending·0 cites
- 1439US2013186565A1Polymer for pressure sensitive adhesive, pressure sensitive adhesive composition and heat-peelable pressure sensitive adhesive sheetNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1538US2005236107A1Method of thermal adherend release and apparatus for thermal adherend releaseNITTO DENKO CORP·Filed 2005·Application pending·0 cites
- 1637US2013260120A1Heat-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1736US2018316045A1Adhesive tapeNITTO DENKO CORP·Filed 2016·Application pending·0 cites
- 1836US2011111563A1Adhesive tape for resin-encapsulating and method of manufacture of resin-encapsulated semiconductor deviceNITTO DENKO CORP·Filed 2010·Application pending·0 cites
- 1932US2012058336A1Temporary fixing sheet for manufacturing process of electronic partsSHIMOKAWA DAISUKE·Filed 2011·Application pending·0 cites
- 2032US2012059124A1Temporary fixing sheetSHIMAZAKI YUTA·Filed 2011·Application pending·0 cites
- 2130US2013330546A1Heat-peelable adhesive sheetTAKAMI Yoshihito·Filed 2012·Application pending·0 cites
- 2228US8524361B2Heat-peelable pressure-sensitive adhesive sheet for cutting laminated ceramic sheet and method for cut-processing laminated ceramic sheetSOEJIMA KAZUKI·Filed 2010·Granted Sep 3, 2013·0 cites·15 claims
- 2327US2014044957A1Production method for electronic component and pressure-sensitive adhesive sheet to be used in the production methodHIRAYAMA TAKAMASA·Filed 2012·Application pending·0 cites
- 2422US2012237764A1Pressure-sensitive adhesive tape for temporary fixing of electronic partSOEJIMA KAZUKI·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →