Inventor · disambiguated record
Dai Shiota
Also filed as: SHIOTA DAI
43 granted patents·20 pending applications·39 citations·filing 2012–2023
95Inventor score
Top patents by PatentIndex Score
63 records- 0191US10539872B2Photosensitive composition and compoundTOKYO OHKA KOGYO CO LTD·Filed 2015·Granted Jan 21, 2020·8 cites·6 claims
- 0289US10059662B2Sulfonium salt, photoacid generator, and photosensitive compositionTOKYO OHKA KOGYO CO LTD·Filed 2015·Granted Aug 28, 2018·5 cites·4 claims
- 0389US9914687B2Composition containing vinyl-group-containing compoundTOKYO OHKA KOGYO CO LTD·Filed 2014·Granted Mar 13, 2018·5 cites·12 claims
- 0488US9902675B2Vinyl-group-containing fluorene compoundTOKYO OHKA KOGYO CO LTD·Filed 2014·Granted Feb 27, 2018·6 cites·2 claims
- 0586US11542397B2Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display deviceTOKYO OHKA KOGYO CO LTD·Filed 2019·Granted Jan 3, 2023·2 cites·12 claims
- 0686US10479879B2Curable composition, cured product of the curable composition, and method of producing a cured product using the curable compositionTOKYO OHKA KOGYO CO LTD·Filed 2018·Granted Nov 19, 2019·2 cites·12 claims
- 0783US11413682B2Method for producing surface-modified metal oxide fine particle, method for producing improved metal oxide fine particles, surface-modified metal oxide fine particles, and metal oxide fine particle dispersion liquidTOKYO OHKA KOGYO CO LTD·Filed 2019·Granted Aug 16, 2022·2 cites·7 claims
- 0881US9547239B2Positive photosensitive resin composition, method for forming polyimide resin patterns, and patterned polyimide resin filmTOKYO OHKA KOGYO CO LTD·Filed 2013·Granted Jan 17, 2017·3 cites·5 claims
- 0979US10696845B2Energy-sensitive resin compositionTOKYO OHKA KOGYO CO LTD·Filed 2016·Granted Jun 30, 2020·2 cites·17 claims
- 1077US10239989B2Curable compositionTOKYO OHKA KOGYO CO LTD·Filed 2015·Granted Mar 26, 2019·1 cites·13 claims
- 1177US10023540B2Hydrogen barrier agent, hydrogen barrier film forming composition, hydrogen barrier film, method for producing hydrogen barrier film, and electronic elementTOKYO OHKA KOGYO CO LTD·Filed 2017·Granted Jul 17, 2018·1 cites·8 claims
- 1276US11905433B2Energy-sensitive composition, cured product, and forming method of cured productTOKYO OHKA KOGYO CO LTD·Filed 2021·Granted Feb 20, 2024·0 cites·8 claims
- 1372US11718717B2Resin composition, method for producing resin composition, film formation method, and cured productTOKYO OHKA KOGYO CO LTD·Filed 2020·Granted Aug 8, 2023·0 cites·9 claims
- 1470US2023416924A1Composition for metal oxide film formation, method for producing composition for metal oxide film formation, and method for producing metal oxide film using the composition for metal oxide film formationTOKYO OHKA KOGYO CO LTD·Filed 2023·Application pending·0 cites
- 1569US10416560B2Coloring agent dispersion, photosensitive resin composition, cured product, organic el element, method for forming pattern, and method for producing photosensitive resin compositionTOKYO OHKA KOGYO CO LTD·Filed 2017·Granted Sep 17, 2019·1 cites·18 claims
- 1668US10767017B2Resin composition, method for producing resin composition, film formation method, and cured productTOKYO OHKA KOGYO CO LTD·Filed 2017·Granted Sep 8, 2020·0 cites·10 claims
- 1767US11142629B2Hydrogen barrier agent, hydrogen barrier film forming composition, hydrogen barrier film, method for producing hydrogen barrier film, and electronic elementTOKYO OHKA KOGYO CO LTD·Filed 2019·Granted Oct 12, 2021·1 cites·8 claims
- 1867US2020270456A1Silicon-containing resin compositionTOKYO OHKA KOGYO CO LTD·Filed 2020·Application pending·0 cites
- 1966US2022274912A1Metal oxide film-forming composition, method for producing metal oxide film using the same, tertiary alkyloxycarbonyl group-modified bisnaphthol fluorene compound, and method for producing the sameTOKYO OHKA KOGYO CO LTD·Filed 2022·Application pending·0 cites
- 2065US11912889B2Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica coating, and production method for silicon-containing polymerTOKYO OHKA KOGYO CO LTD·Filed 2020·Granted Feb 27, 2024·0 cites·12 claims
- 2165US2022144745A1Energy-sensitive composition, cured product, forming method of cured product, thermal base generator and compoundTOKYO OHKA KOGYO CO LTD·Filed 2021·Application pending·0 cites
- 2264US10689514B2Silicon-containing resin compositionTOKYO OHKA KOGYO CO LTD·Filed 2016·Granted Jun 23, 2020·0 cites·7 claims
- 2364US2022282100A1Metal oxide film-forming composition, and method for producing metal oxide film using the sameTOKYO OHKA KOGYO CO LTD·Filed 2022·Application pending·0 cites
- 2462US2022145125A1Energy-sensitive composition, cured product, forming method of cured product, thermal base generator and compoundTOKYO OHKA KOGYO CO LTD·Filed 2021·Application pending·0 cites
- 2560US12099297B2Energy-sensitive composition, cured product, and forming method of patterned cured productTOKYO OHKA KOGYO CO LTD·Filed 2021·Granted Sep 24, 2024·0 cites·8 claims
- 2658US2023049429A1Metal oxide film-forming composition and method of producing metal oxide film using the compositionTOKYO OHKA KOGYO CO LTD·Filed 2022·Application pending·0 cites
- 2758US2025333548A1Composition and photosensitive compositionTOKYO OHKA KOGYO CO LTD·Filed 2023·Application pending·0 cites
- 2857US2022213348A1Silicon-containing polymer, film-forming composition, method for supporting metal compound on surface of object to be treated, article having metal compound-supporting coating film, and method for producing silicon-containing polymerTOKYO OHKA KOGYO CO LTD·Filed 2020·Application pending·0 cites
- 2956US2018050973A1Vinyl-group-containing fluorene compoundTOKYO OHKA KOGYO CO LTD·Filed 2017·Application pending·0 cites
- 3056US2021189080A1Composition for forming hard coat, method for producing article having hard coat, hard coat, hard-coated article, and silane-modified alicyclic compoundTOKYO OHKA KOGYO CO LTD·Filed 2020·Application pending·0 cites
- 3155US11260635B2Resin composition, method for producing cured article, cured article, flexible substrate, and flexible displayTOKYO OHKA KOGYO CO LTD·Filed 2018·Granted Mar 1, 2022·0 cites·20 claims
- 3255US11106132B2Energy-sensitive composition, cured product, and pattern forming methodTOKYO OHKA KOGYO CO LTD·Filed 2019·Granted Aug 31, 2021·0 cites·10 claims
- 3355US9891527B2Developing solution and development processing method of photosensitive resin compositionTOKYO OHKA KOGYO CO LTD·Filed 2014·Granted Feb 13, 2018·0 cites·20 claims
- 3454US2025388766A1Metal oxide disperson and method for manufacturing metal oxide film using sameTOKYO OHKA KOGYO CO LTD·Filed 2023·Application pending·0 cites
- 3553US11274245B2Curable composition, film, optical film, light-emitting display element panel, and light-emitting displayTOKYO OHKA KOGYO CO LTD·Filed 2018·Granted Mar 15, 2022·0 cites·11 claims
- 3653US10570269B2Composition containing microparticlesTOKYO OHKA KOGYO CO LTD·Filed 2016·Granted Feb 25, 2020·0 cites·7 claims
- 3753US9458355B2Method of producing polyimide resin, method of producing polyimide coating, method of producing polyamic acid solution, polyimide coating, and polyamic acid solutionTOKYO OHKA KOGYO CO LTD·Filed 2013·Granted Oct 4, 2016·0 cites·2 claims
- 3853US2023038195A1Photosensitive composition, cured product, and method for producing cured productTOKYO OHKA KOGYO CO LTD·Filed 2020·Application pending·0 cites
- 3951US2024027889A1Metal oxide film-forming composition, method for producing metal oxide films using same, and method for reducing volume shrinkage ratio of metal oxide filmsTOKYO OHKA KOGYO CO LTD·Filed 2021·Application pending·0 cites
- 4050US2025060668A1Photosensitive compositionTOKYO OHKA KOGYO CO LTD·Filed 2022·Application pending·0 cites
- 4149US11718587B2Compound, epoxy curing catalyst and method for producing compoundTOKYO OHKA KOGYO CO LTD·Filed 2018·Granted Aug 8, 2023·0 cites·4 claims
- 4249US11267932B2Curable composition, cured film, display panel or OLED light, and method for producing cured productTOKYO OHKA KOGYO CO LTD·Filed 2018·Granted Mar 8, 2022·0 cites·16 claims
- 4349US2016170302A1Novel compoundTOKYO OHKA KOGYO CO LTD·Filed 2016·Application pending·0 cites
- 4449US2025138421A1Photosensitive compositionTOKYO OHKA KOGYO CO LTD·Filed 2022·Application pending·0 cites
- 4548US10640607B2Curable composition, cured film, display panel, and method for producing cured productTOKYO OHKA KOGYO CO LTD·Filed 2018·Granted May 5, 2020·0 cites·13 claims
- 4648US10336708B2Imidazole compound, metal surface treatment liquid, metal surface treatment method, and laminate production methodTOKYO OHKA KOGYO CO LTD·Filed 2015·Granted Jul 2, 2019·0 cites·15 claims
- 4747US11174221B2Aromatic amine compound, curing agent for epoxy compound, curable composition, cured product, method for producing cured product, and method for producing aromatic amine compoundTOKYO OHKA KOGYO CO LTD·Filed 2018·Granted Nov 16, 2021·0 cites·15 claims
- 4847US10829662B2Curable composition, cured product, cured film, display panel, and method for producing cured productTOKYO OHKA KOGYO CO LTD·Filed 2018·Granted Nov 10, 2020·0 cites·15 claims
- 4946US10233269B2Compound containing structural unit derived from vinyl ether compoundTOKYO OHKA KOGYO CO LTD·Filed 2014·Granted Mar 19, 2019·0 cites·18 claims
- 5044US11136435B2Method for producing polyimide film, polyimide film, polyamic acid solution, and photosensitive compositionENEOS CORP·Filed 2017·Granted Oct 5, 2021·0 cites·7 claims
Showing the top 50 of 63 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Dai Shiota files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →