Inventor · disambiguated record
Daihei Sugita
Also filed as: SUGITA DAIHEI
0 granted patents·5 pending applications·0 citations·filing 2004–2011
Top patents by PatentIndex Score
5 records- 0147US2012037223A1Binder resin for conductive paste, conductive paste, and solar cell elementYAMANAKA ISAO·Filed 2010·Application pending·0 cites
- 0236US2007037364A1Method for manufacturing semiconductor chipSUGITA DAIHEI·Filed 2004·Application pending·0 cites
- 0335US2008314507A1Ic Chip Manufacturing MethodHATAI MUNEHIRO·Filed 2004·Application pending·0 cites
- 0431US2013220533A1Pressure-sensitive adhesive compound, pressure-sensitive adhesive tape, and wafer treatment methodTONEGAWA TORU·Filed 2011·Application pending·0 cites
- 0526US2013071658A1Adhesive composition, adhesive tape, method for processing semiconductor wafer and method for producing tsv waferNOMURA SHIGERU·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →