Inventor · disambiguated record
Daiki Sugiyama
Also filed as: SUGIYAMA DAIKI
1 granted patent·3 pending applications·10 citations·filing 2001–2025
32Inventor score
Top patents by PatentIndex Score
4 records- 0162US2024368336A1Modified epoxy resin, curable resin composition, and cured product thereofMITSUBISHI CHEM CORP·Filed 2024·Application pending·0 cites
- 0261US6501497B2Thermal head with small size of steps of protective layer formed on heating portion and manufacturing method thereofALPS ELECTRIC CO LTD·Filed 2001·Granted Dec 31, 2002·10 cites·5 claims
- 0353US2023229137A1Analysis device, analysis method and non-transitory computer-readable storage mediumOMRON TATEISI ELECTRONICS CO·Filed 2022·Application pending·0 cites
- 0445US2025368773A1Epoxy resin, production method for same, curable resin composition, and cured productMITSUBISHI CHEM CORP·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →