Inventor · disambiguated record
Daewoong Suh
Also filed as: SUH DAEWOONG · SUH DAEWOONG DAVE
99 granted patents·39 pending applications·484 citations·filing 2004–2021
99Inventor score
Top patents by PatentIndex Score
138 records- 0199US9318529B2Wafer level light-emitting diode arraySEOUL VIOSYS CO LTD·Filed 2015·Granted Apr 19, 2016·32 cites·19 claims
- 0298US11139338B2Wafer level light-emitting diode arraySEOUL VIOSYS CO LTD·Filed 2020·Granted Oct 5, 2021·4 cites·21 claims
- 0397US9412922B2Wafer level light-emitting diode arraySEOUL VIOSYS CO LTD·Filed 2013·Granted Aug 9, 2016·22 cites·27 claims
- 0497US7224067B2Intermetallic solder with low melting pointINTEL CORP·Filed 2005·Granted May 29, 2007·17 cites·17 claims
- 0596US9318530B2Wafer level light-emitting diode array and method for manufacturing sameSEOUL VIOSYS CO LTD·Filed 2013·Granted Apr 19, 2016·15 cites·26 claims
- 0694US7187068B2Methods and apparatuses for providing stacked-die devicesINTEL CORP·Filed 2004·Granted Mar 6, 2007·71 cites·20 claims
- 0793US9847457B2Light emitting diode, method of fabricating the same and LED module having the sameSEOUL VIOSYS CO LTD·Filed 2015·Granted Dec 19, 2017·7 cites·23 claims
- 0893US7947134B2Process for joining materials using bulk metallic glassesCALIFORNIA INST OF TECHN·Filed 2008·Granted May 24, 2011·19 cites·25 claims
- 0992US10804316B2Wafer level light-emitting diode arraySEOUL VIOSYS CO LTD·Filed 2017·Granted Oct 13, 2020·3 cites·36 claims
- 1091US7666768B2Through-die metal vias with a dispersed phase of graphitic structures of carbon for reduced thermal expansion and increased electrical conductanceINTEL CORP·Filed 2006·Granted Feb 23, 2010·23 cites·8 claims
- 1190US11587972B2Wafer level light-emitting diode arraySEOUL VIOSYS CO LTD·Filed 2021·Granted Feb 21, 2023·1 cites·20 claims
- 1290US10388690B2Wafer level light-emitting diode arraySEOUL VIOSYS CO LTD·Filed 2016·Granted Aug 20, 2019·6 cites·23 claims
- 1390US9768362B2Light-emitting device and method of manufacturing the sameSEOUL VIOSYS CO LTD·Filed 2015·Granted Sep 19, 2017·6 cites·17 claims
- 1490US9240524B2Light-emitting device and method of manufacturing the sameSEOUL VIOSYS CO LTD·Filed 2013·Granted Jan 19, 2016·9 cites·23 claims
- 1590US8916898B2Wafer level LED package and method of fabricating the sameSEOUL VIOSYS CO LTD·Filed 2013·Granted Dec 23, 2014·5 cites·13 claims
- 1690US7700476B2Solder joint reliability in microelectronic packagingINTEL CORP·Filed 2006·Granted Apr 20, 2010·15 cites·19 claims
- 1790US7371674B2Nanostructure-based package interconnectINTEL CORP·Filed 2005·Granted May 13, 2008·29 cites·9 claims
- 1889US9634193B2Light emitting diode and method of manufacturing the sameSEOUL VIOSYS CO LTD·Filed 2015·Granted Apr 25, 2017·5 cites·20 claims
- 1988US10756237B2Light emitting diode and light emitting diode packageSEOUL VIOSYS CO LTD·Filed 2019·Granted Aug 25, 2020·3 cites·18 claims
- 2087US9912790B2Sterilizing apparatus for portable terminalSEOUL VIOSYS CO LTD·Filed 2014·Granted Mar 6, 2018·9 cites·16 claims
- 2187US7713858B2Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing sameINTEL CORP·Filed 2006·Granted May 11, 2010·11 cites·20 claims
- 2286US9343627B2Electronic device comprising semiconductor memory having ohmic-contact structure separated from current distributing layerSEOUL VIOSYS CO LTD·Filed 2014·Granted May 17, 2016·6 cites·15 claims
- 2385US10319884B2Light emitting diodeSEOUL VIOSYS CO LTD·Filed 2016·Granted Jun 11, 2019·3 cites·19 claims
- 2485US9520543B2Light-emitting diode module having light-emitting diode joined through solder paste and light-emitting diodeSEOUL VIOSYS CO LTD·Filed 2015·Granted Dec 13, 2016·3 cites·11 claims
- 2585US7402909B2Microelectronic package interconnect and method of fabrication thereofINTEL CORP·Filed 2005·Granted Jul 22, 2008·12 cites·15 claims
- 2684US9548425B2Light-emitting diode and application thereforSEOUL VIOSYS CO LTD·Filed 2015·Granted Jan 17, 2017·3 cites·20 claims
- 2784US8409929B2Forming a semiconductor package including a thermal interface materialRENAVIKAR MUKUL·Filed 2011·Granted Apr 2, 2013·7 cites·14 claims
- 2884US7535099B2Sintered metallic thermal interface materials for microelectronic cooling assembliesINTEL CORP·Filed 2006·Granted May 19, 2009·12 cites·27 claims
- 2983US8344483B2Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing sameINTEL CORP·Filed 2010·Granted Jan 1, 2013·5 cites·10 claims
- 3082US10784406B2Light emitting diode, method of fabricating the same and led module having the sameSEOUL VIOSYS CO LTD·Filed 2020·Granted Sep 22, 2020·1 cites·19 claims
- 3182US9893240B2Light emitting diode and LED module having the sameSEOUL VIOSYS CO LTD·Filed 2016·Granted Feb 13, 2018·3 cites·19 claims
- 3282US9123866B2Light emitting device having wide beam angle and method of fabricating the sameSEOUL VIOSYS CO LTD·Filed 2014·Granted Sep 1, 2015·2 cites·6 claims
- 3381US10439105B2Light emitting diode and light emitting diode packageSEOUL VIOSYS CO LTD·Filed 2016·Granted Oct 8, 2019·2 cites·19 claims
- 3480US10297720B2Light emitting diode and method of manufacturing the sameSEOUL VIOSYS CO LTD·Filed 2015·Granted May 21, 2019·2 cites·19 claims
- 3580US9711354B2Method of fabricating light emitting device through forming a template for growing semiconductor and separating growth substrateSEOUL VIOSYS CO LTD·Filed 2014·Granted Jul 18, 2017·4 cites·13 claims
- 3680US7699210B2Soldering an electronics package to a motherboardINTEL CORP·Filed 2008·Granted Apr 20, 2010·6 cites·20 claims
- 3780US7628871B2Bulk metallic glass solder materialINTEL CORP·Filed 2005·Granted Dec 8, 2009·7 cites·8 claims
- 3879US9392804B2Multi-purpose conservation apparatusSEOUL VIOSYS CO LTD·Filed 2013·Granted Jul 19, 2016·1 cites·19 claims
- 3979US9059012B2Epitaxial layer wafer having void for separating growth substrate therefrom and semiconductor device fabricated using the sameSEOUL VIOSYS CO LTD·Filed 2013·Granted Jun 16, 2015·3 cites·28 claims
- 4079US7629203B2Thermal interface material for combined reflowINTEL CORP·Filed 2008·Granted Dec 8, 2009·5 cites·22 claims
- 4178US9536924B2Light-emitting diode and application thereforSEOUL VIOSYS CO LTD·Filed 2015·Granted Jan 3, 2017·3 cites·20 claims
- 4277US9640719B2Light emitting diode, method of fabricating the same and LED module having the sameSEOUL VIOSYS CO LTD·Filed 2015·Granted May 2, 2017·2 cites·16 claims
- 4377US7710709B2Carbon nanotube coated capacitor electrodesINTEL CORP·Filed 2007·Granted May 4, 2010·7 cites·8 claims
- 4475US10062810B2Light-emitting diode module having light-emitting diode joined through solder paste and light-emitting diodeSEOUL VIOSYS CO LTD·Filed 2018·Granted Aug 28, 2018·1 cites·21 claims
- 4575US9142480B2Microelectronic package with high temperature thermal interface materialHOULE SABINA·Filed 2008·Granted Sep 22, 2015·8 cites·2 claims
- 4675US7867818B2Methods and apparatuses for providing stacked-die devicesSUH DAEWOONG·Filed 2005·Granted Jan 11, 2011·6 cites·15 claims
- 4775US7745013B2Solder foams, nano-porous solders, foamed-solder bumps in chip packages, methods of assembling same, and systems containing sameINTEL CORP·Filed 2005·Granted Jun 29, 2010·6 cites·16 claims
- 4875US7727814B2Microelectronic package interconnect and method of fabrication thereofINTEL CORP·Filed 2008·Granted Jun 1, 2010·5 cites·14 claims
- 4974US10573785B2Light emitting diode, method of fabricating the same and LED module having the sameSEOUL VIOSYS CO LTD·Filed 2017·Granted Feb 25, 2020·1 cites·18 claims
- 5074US9991425B2Light emitting device having wide beam angle and method of fabricating the sameSEOUL VIOSYS CO LTD·Filed 2017·Granted Jun 5, 2018·1 cites·12 claims
Showing the top 50 of 138 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →