Inventor · disambiguated record

Daiji Sukawa

Also filed as: SUKAWA DAIJI

2 granted patents·49 citations·filing 1994–2006

60Inventor score

Technology areasB23K B23Q

Files withHONDA MOTOR CO LTD2

Top patents by PatentIndex Score

2 records

0179US5548096AMethod and apparatus for assembling motor vehicle bodyHONDA MOTOR CO LTD·Filed 1994·Granted Aug 20, 1996·47 cites·9 claims
0250US7255336B2Workpiece clamp device and methodHONDA MOTOR CO LTD·Filed 2006·Granted Aug 14, 2007·2 cites·5 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →