Inventor · disambiguated record
Daichi Terayama
Also filed as: TERAYAMA DAICHI
2 granted patents·0 citations·filing 2023–2024
22Inventor score
Technology areasB29K
Files withSUBARU CORP2
Top patents by PatentIndex Score
2 records- 0161US12502848B2Fiber placement apparatus and method of molding composite materialSUBARU CORP·Filed 2024·Granted Dec 23, 2025·0 cites·12 claims
- 0258US12459216B2Roller unit for feeding tapes, fiber placement apparatus and method of molding composite materialSUBARU CORP·Filed 2023·Granted Nov 4, 2025·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Daichi Terayama files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →