Inventor · disambiguated record
Daniele Torresin
Also filed as: TORRESIN DANIELE
23 granted patents·9 pending applications·11 citations·filing 2014–2024
90Inventor score
Files withABB SCHWEIZ AG19ABB TECHNOLOGY OY3AUDI AG3HITACHI ENERGY LTD2HITACHI ENERGY SWITZERLAND AG2
Top patents by PatentIndex Score
32 records- 0187US12066255B2Blank for a heat-transfer device and method to produce a heat-transfer deviceABB SCHWEIZ AG·Filed 2022·Granted Aug 20, 2024·1 cites·11 claims
- 0285US11369042B2Heat exchanger with integrated two-phase heat spreaderABB SCHWEIZ AG·Filed 2020·Granted Jun 21, 2022·2 cites·14 claims
- 0378US11848252B2Semiconductor component, motor vehicle, and method for producing a semiconductor componentAUDI AG·Filed 2020·Granted Dec 19, 2023·1 cites·5 claims
- 0477US10080315B2Cooling device and method for cooling at least two power electronic devicesABB SCHWEIZ AG·Filed 2016·Granted Sep 18, 2018·3 cites·23 claims
- 0571US10077947B2Cooling assembly and method for manufacturing the sameABB SCHWEIZ AG·Filed 2016·Granted Sep 18, 2018·2 cites·17 claims
- 0671US9909817B2Cooling elementABB TECHNOLOGY OY·Filed 2015·Granted Mar 6, 2018·2 cites·11 claims
- 0761US12156378B2Vapor chamber for cooling an electronic component, electronic arrangement, and method for manufacturing the vapor chamberABB SCHWEIZ AG·Filed 2021·Granted Nov 26, 2024·0 cites·14 claims
- 0858US2024334662A1Vapor chamber with integrated bubble pumpABB SCHWEIZ AG·Filed 2024·Application pending·0 cites
- 0955US9888612B2Heat exchanger for power-electronic componentsABB SCHWEIZ AG·Filed 2017·Granted Feb 6, 2018·0 cites·20 claims
- 1053US12196497B2Heat dissipation deviceABB SCHWEIZ AG·Filed 2021·Granted Jan 14, 2025·0 cites·13 claims
- 1153US11837427B2Arc chamber for a low-voltage switching deviceABB SPA·Filed 2018·Granted Dec 5, 2023·0 cites·20 claims
- 1253US2024353293A1Method and controller for testing a two-phase cooling device, computer program, and computer-readable mediumABB SCHWEIZ AG·Filed 2022·Application pending·0 cites
- 1352US12068174B2Arrangement of a power semiconductor module and a coolerHITACHI ENERGY LTD·Filed 2020·Granted Aug 20, 2024·0 cites·23 claims
- 1451US11197392B2Method of forming a 3D-vapor chamberABB SCHWEIZ AG·Filed 2020·Granted Dec 7, 2021·0 cites·19 claims
- 1550US12199013B2Arrangement comprising a baseplate for a power semiconductor module and a coolerHITACHI ENERGY LTD·Filed 2020·Granted Jan 14, 2025·0 cites·20 claims
- 1650US2015003014A1Electric apparatusABB RESEARCH LTD·Filed 2014·Application pending·0 cites
- 1748US2022196338A1Heat-transfer device and method to produce such a deviceABB SCHWEIZ AG·Filed 2021·Application pending·0 cites
- 1847US12160982B2Direct cooling of a power converter by using a stamped plateAUDI AG·Filed 2020·Granted Dec 3, 2024·0 cites·14 claims
- 1946US10096538B2Cooling of wide bandgap semiconductor devicesABB SCHWEIZ AG·Filed 2017·Granted Oct 9, 2018·0 cites·19 claims
- 2046US2024030101A1Power Module and Method for Producing a Power ModuleHITACHI ENERGY SWITZERLAND AG·Filed 2021·Application pending·0 cites
- 2145US2017181319A1Cooling apparatusABB TECHNOLOGY OY·Filed 2016·Application pending·0 cites
- 2245US2021125898A1Vapor chamberABB SCHWEIZ AG·Filed 2020·Application pending·0 cites
- 2344US12016162B2Electric power converter device with improved integration of cooler frameAUDI AG·Filed 2020·Granted Jun 18, 2024·0 cites·14 claims
- 2444US2021125894A1Two-phase heat transfer device for heat dissipationABB SCHWEIZ AG·Filed 2020·Application pending·0 cites
- 2544US2021095931A1Vapor chamber for cooling an electronic componentABB SCHWEIZ AG·Filed 2020·Application pending·0 cites
- 2642US10748682B2Surge arrester system and circuit breaker systemABB SCHWEIZ AG·Filed 2017·Granted Aug 18, 2020·0 cites·19 claims
- 2741US10517195B2Heat exchanger assembly and method for operating a heat exchanger assemblyABB SCHWEIZ AG·Filed 2018·Granted Dec 24, 2019·0 cites·21 claims
- 2841US9607924B2Power semiconductor module and method for cooling power semiconductor moduleABB TECHNOLOGY OY·Filed 2015·Granted Mar 28, 2017·0 cites·5 claims
- 2938US11562911B2Power semiconductor module and method of forming the sameHITACHI ENERGY SWITZERLAND AG·Filed 2020·Granted Jan 24, 2023·0 cites·10 claims
- 3036US10674630B2Heat exchange device based on a pulsating heat pipeABB TECHNOLOGY AG·Filed 2016·Granted Jun 2, 2020·0 cites·20 claims
- 3136US9958213B2Heat exchangerABB SCHWEIZ AG·Filed 2016·Granted May 1, 2018·0 cites·20 claims
- 3234US10212862B2Cooling apparatus and methodABB SCHWEIZ AG·Filed 2016·Granted Feb 19, 2019·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →