Inventor · disambiguated record
David Unruh
Also filed as: UNRUH JR DAVID ALLEN · Unruh David
5 granted patents·3 pending applications·6 citations·filing 2016–2019
70Inventor score
Files withINTEL CORP8
Top patents by PatentIndex Score
8 records- 0180US10049996B2Surface finishes for high density interconnect architecturesINTEL CORP·Filed 2016·Granted Aug 14, 2018·3 cites·6 claims
- 0273US11127682B2Semiconductor package having nonspherical filler particlesINTEL CORP·Filed 2017·Granted Sep 21, 2021·2 cites·15 claims
- 0370US10438914B2Surface finishes for high density interconnect architecturesINTEL CORP·Filed 2018·Granted Oct 8, 2019·1 cites·18 claims
- 0460US10998282B2Surface finishes for high density interconnect architecturesINTEL CORP·Filed 2019·Granted May 4, 2021·0 cites·16 claims
- 0544US11276634B2High density package substrate formed with dielectric bi-layerINTEL CORP·Filed 2017·Granted Mar 15, 2022·0 cites·19 claims
- 0635US2020066626A1Pocket structures, materials, and methods for integrated circuit package supportsINTEL CORP·Filed 2018·Application pending·0 cites
- 0735US2019279935A1Semiconductor package having package substrate containing non-homogeneous dielectric layerINTEL CORP·Filed 2016·Application pending·0 cites
- 0834US2019287915A1Methods of forming barrier structures in high density package substratesINTEL CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →