Inventor · disambiguated record
Darren Jay Walworth
Also filed as: WALWORTH DARREN · WALWORTH DARREN JAY
6 granted patents·23 citations·filing 2009–2022
78Inventor score
Top patents by PatentIndex Score
6 records- 0183US8367469B2Chip-scale semiconductor die packaging methodSEMTECH CORP·Filed 2012·Granted Feb 5, 2013·6 cites·14 claims
- 0279US11507170B1Power management and current/ramp detection mechanismMARVELL ASIA PTE LTD·Filed 2020·Granted Nov 22, 2022·1 cites·24 claims
- 0379US8487430B1Multi-layer high-speed integrated circuit ball grid array package and processWALWORTH DARREN JAY·Filed 2010·Granted Jul 16, 2013·11 cites·17 claims
- 0468US11789513B1Power management and current/ramp detection mechanismMARVELL ASIA PTE LTD·Filed 2022·Granted Oct 17, 2023·0 cites·20 claims
- 0565US8093714B2Chip assembly with chip-scale packagingBONTHRON ANDREW J·Filed 2009·Granted Jan 10, 2012·4 cites·24 claims
- 0661US8703540B2Chip-scale semiconductor die packaging methodSEMTECH CORP·Filed 2013·Granted Apr 22, 2014·1 cites·6 claims
Join the waitlist — get patent alerts
Get an alert when Darren Jay Walworth files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →