Inventor · disambiguated record
David J. Womac
Also filed as: WOMAC DAVID J
9 granted patents·2 pending applications·292 citations·filing 1998–2018
90Inventor score
Top patents by PatentIndex Score
11 records- 0190US8328026B2Apparatus and method for configuring a dual rack-mountable chassisBODUCH MARK E·Filed 2008·Granted Dec 11, 2012·16 cites·21 claims
- 0290US6085831ADirect chip-cooling through liquid vaporization heat exchangeIBM·Filed 1999·Granted Jul 11, 2000·115 cites·51 claims
- 0382US5981310AMulti-chip heat-sink cap assemblyIBM·Filed 1998·Granted Nov 9, 1999·59 cites·11 claims
- 0475US8944896B2Apparatus, system, and method for venting a chassisWOMAC DAVID J·Filed 2008·Granted Feb 3, 2015·7 cites·20 claims
- 0571US6333460B1Structural support for direct lid attachIBM·Filed 2000·Granted Dec 25, 2001·18 cites·6 claims
- 0670US6373133B1Multi-chip module and heat-sink cap combinationIBM·Filed 1999·Granted Apr 16, 2002·34 cites·15 claims
- 0760US2018306195A1Field configurable fan operational profilesCORIANT OPERATIONS INC·Filed 2018·Application pending·0 cites
- 0859US6222263B1Chip assembly with load-bearing lid in thermal contact with the chipIBM·Filed 1999·Granted Apr 24, 2001·24 cites·9 claims
- 0953US10036396B2Field configurable fan operational profilesCORIANT OPERATIONS INC·Filed 2013·Granted Jul 31, 2018·0 cites·25 claims
- 1053US6214647B1Method for bonding heatsink to multiple-height chipIBM·Filed 1998·Granted Apr 10, 2001·19 cites·20 claims
- 1137US2002017715A1Method for bonding heatsink to multiple-height chipFiled 2001·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when David J. Womac files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →