Inventor · disambiguated record

Dai-You Wu

Also filed as: Wu dai-you

1 granted patent·0 citations·filing 2019–2019

1Inventor score

Technology areasB29C

Files withUNIV NAT KAOHSIUNG SCIENCE & TECHNOLOGY1

Top patents by PatentIndex Score

1 record

0142US11173637B2Forming mold with linkage type lateral auxiliary pressurizationUNIV NAT KAOHSIUNG SCIENCE & TECHNOLOGY·Filed 2019·Granted Nov 16, 2021·0 cites·14 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →