Inventor · disambiguated record
Danfeng Yang
Also filed as: YANG DANFENG
5 granted patents·9 pending applications·0 citations·filing 2020–2024
58Inventor score
Top patents by PatentIndex Score
14 records- 0160US2025062298A1Package structure and method for forming sameJCET GROUP CO LTD·Filed 2024·Application pending·0 cites
- 0259US2024162267A1Microminiature image acquisition and processing system packaging structure and preparation method thereofJCET GROUP CO LTD·Filed 2023·Application pending·0 cites
- 0359US2025062215A1Package structure and method for forming sameJCET GROUP CO LTD·Filed 2024·Application pending·0 cites
- 0458US2025140730A1Semiconductor Device and Method of Forming Fan-Out Package Structure with Embedded Overhanging Backside AntennaSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 0557US2025132291A1Semiconductor Device and Method of Making a Dual-Sided Bridge Die Package StructureSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 0656US2025259947A1Semiconductor Device and Method of Forming AIP Package Structure from Separate Assemblies with Bonding MaterialSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 0753US12148681B2Fan-out package structure and method for manufacturing the sameJCET GROUP CO LTD·Filed 2021·Granted Nov 19, 2024·0 cites·19 claims
- 0853US2024413040A1Package structure and manufacturing method thereofJCET GROUP CO LTD·Filed 2024·Application pending·0 cites
- 0952US12500329B2Antenna packaging structure and manufacturing method thereofJCET GROUP CO LTD·Filed 2021·Granted Dec 16, 2025·0 cites·20 claims
- 1051US11854949B2Package structure having a plurality of chips attached to a lead frame by redistribution layerJCET GROUP CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 1150US12482765B2Packaging structure and manufacturing method thereofJCET GROUP CO LTD·Filed 2021·Granted Nov 25, 2025·0 cites·16 claims
- 1249US2023187363A1Packaging structure and manufacturing method thereofJCET GROUP CO LTD·Filed 2022·Application pending·0 cites
- 1344US12249582B2SIP package structureJCET GROUP CO LTD·Filed 2020·Granted Mar 11, 2025·0 cites·16 claims
- 1442US2023282599A1Fan-out packaging structure and manufacturing method thereofJCET GROUP CO LTD·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →