Inventor · disambiguated record
Daohong Yang
Also filed as: YANG DAOHONG
0 granted patents·3 pending applications·0 citations·filing 2021–2022
Files withWUHAN XINXIN SEMICONDUCTOR MFG3
Top patents by PatentIndex Score
3 records- 0151US2024105532A1Chip packaging method and chip packaging structureWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2022·Application pending·0 cites
- 0245US2023170223A1Semiconductor device and manufacturing method thereofWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2021·Application pending·0 cites
- 0341US2025329588A1Tsv electrical connection structure having high aspect ratio and manufacturing method thereforWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →