Inventor · disambiguated record
Daniel Yim
Also filed as: YIM DANIEL · YIM DANIEL H
12 granted patents·5 pending applications·451 citations·filing 1998–2009
94Inventor score
Top patents by PatentIndex Score
17 records- 0195USD583479SPersonal warming apparatusHEATMAX INC·Filed 2007·Granted Dec 23, 2008·77 cites·1 claims
- 0293USD582047SCapsule warmerHEATMAX INC·Filed 2006·Granted Dec 2, 2008·58 cites·1 claims
- 0391USD609360SCrescent warmerHEATMAX INC·Filed 2008·Granted Feb 2, 2010·49 cites·1 claims
- 0491USD583959SCrescent warmerHEATMAX INC·Filed 2006·Granted Dec 30, 2008·48 cites·1 claims
- 0590USD602598SButterfly-shaped warmerHEATMAX INC·Filed 2009·Granted Oct 20, 2009·45 cites·1 claims
- 0685USD609359SCrescent warmerHEATMAX INC·Filed 2008·Granted Feb 2, 2010·33 cites·1 claims
- 0784USD609357SPersonal warming apparatusHEATMAX INC·Filed 2008·Granted Feb 2, 2010·30 cites·1 claims
- 0881USD609358SPersonal warming apparatusHEATMAX INC·Filed 2008·Granted Feb 2, 2010·26 cites·1 claims
- 0972US6358852B1Decapsulation techniques for multi-chip (MCP) devicesADVANCED MICRO DEVICES INC·Filed 2000·Granted Mar 19, 2002·19 cites·22 claims
- 1071US6886553B2Self-contained personal warming apparatus and method of warmingHEATMAX INC·Filed 2003·Granted May 3, 2005·40 cites·11 claims
- 1155US6181017B1System for marking electrophoretic dies while reducing damage due to electrostatic dischargeADVANCED MICRO DEVICES INC·Filed 1999·Granted Jan 30, 2001·21 cites·13 claims
- 1248US2005172951A1Multi-seamed self-contained personal warming apparatus and method of warmingHEATMAX INC·Filed 2005·Application pending·0 cites
- 1344US2007256678A1Multi-seamed warming devices with adhesive disposed thereon and methods of warmingHEATMAX INC·Filed 2007·Application pending·0 cites
- 1444US2007256679A1Warming devices with elastic disposed therein and methods of warmingHEATMAX INC·Filed 2007·Application pending·0 cites
- 1542US2007256677A1Multi-seamed warming devices with adhesive and methods of warmingYIM DANIEL H·Filed 2007·Application pending·0 cites
- 1636US6147399ABackside exposure of desired nodes in a multi-layer integrated circuitADVANCED MICRO DEVICES INC·Filed 1998·Granted Nov 14, 2000·5 cites·6 claims
- 1729US2002046855A1Underfill removal for easing separation of an integrated circuit device and packageFiled 1999·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Daniel Yim files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →