Inventor · disambiguated record
Daehan Youn
Also filed as: YOUN DAEHAN
0 granted patents·2 pending applications·0 citations·filing 2022–2023
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD2
Top patents by PatentIndex Score
2 records- 0158US2024371718A1Semiconductor package including heat dissipation structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0254US2023107103A1System on chip having three-dimensional chiplet structure and electronic device including the system on chipSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →