Inventor · disambiguated record
Daquan Yu
Also filed as: YU DAQUAN
4 granted patents·5 pending applications·11 citations·filing 2010–2022
64Inventor score
Files withNAT CT FOR ADVANCED PACKAGING3HUATIAN TECH KUNSHAN ELECT CO LTD2KOTLANKA RAMA KRISHNA2XIAMEN SKY SEMICONDUCTOR TECH CO LTD1YU DAQUAN1
Top patents by PatentIndex Score
9 records- 0182US10559525B2Embedded silicon substrate fan-out type 3D packaging structureHUATIAN TECH KUNSHAN ELECT CO LTD·Filed 2018·Granted Feb 11, 2020·9 cites·15 claims
- 0267US9368376B2Mechanical debonding method and systemNAT CT FOR ADVANCED PACKAGING·Filed 2014·Granted Jun 14, 2016·2 cites·19 claims
- 0341US12014965B2Three-dimensional packaging structure and method for fan-out of bonding wall of deviceXIAMEN SKY SEMICONDUCTOR TECH CO LTD·Filed 2022·Granted Jun 18, 2024·0 cites·17 claims
- 0441US9293368B2Method for removing electroplated metal facets and reusing a barrier layer without chemical mechanical polishingNAT CT FOR ADVANCED PACKAGING·Filed 2014·Granted Mar 22, 2016·0 cites·14 claims
- 0537US2013324863A1Guide wire arrangement, strip arrangement and methods of forming the sameYU DAQUAN·Filed 2011·Application pending·0 cites
- 0636US2014370703A1TSV Front-top Interconnection ProcessNAT CT FOR ADVANCED PACKAGING·Filed 2014·Application pending·0 cites
- 0734US2013053730A1Miniature Sensor Tip for Medical Devices and Method of Forming the SameKOTLANKA RAMA KRISHNA·Filed 2010·Application pending·0 cites
- 0834US2013053711A1Implantable Device for Detecting Variation in Fluid Flow RateKOTLANKA RAMA KRISHNA·Filed 2010·Application pending·0 cites
- 0929US2018182727A1Embedded silicon substrate fan-out type packaging structure and manufacturing method thereforHUATIAN TECH KUNSHAN ELECT CO LTD·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →