Inventor · disambiguated record
Da-Cyuan Yu
Also filed as: YU DA-CYUAN
3 granted patents·1 pending application·23 citations·filing 2017–2024
69Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD4
Top patents by PatentIndex Score
4 records- 0194US10770405B2Thermal interface material having different thicknesses in packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 8, 2020·11 cites·20 claims
- 0294US10707177B2Thermal interface material having different thicknesses in packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 7, 2020·11 cites·20 claims
- 0382US11916023B2Thermal interface material having different thicknesses in packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 27, 2024·1 cites·20 claims
- 0479US2024162166A1Thermal interface material having different thicknesses in packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →