Inventor · disambiguated record
Dao Zhang
Also filed as: ZHANG DAO · ZHANG DAO HUA
1 granted patent·2 pending applications·5 citations·filing 2003–2015
27Inventor score
Top patents by PatentIndex Score
3 records- 0146US6872657B2Method to form copper seed layer for copper interconnectAGENCY SCIENCE TECH & RES·Filed 2003·Granted Mar 29, 2005·5 cites·32 claims
- 0239US2016340765A1Zirconium-based amorphous alloy and manufacturing method thereofJI ZHUN PREC IND (HUI ZHOU) CO LTD·Filed 2015·Application pending·0 cites
- 0333US2016187064A1CrucibleJI ZHUN PREC IND HUI ZHOU CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →