Inventor · disambiguated record
David Ziger
Also filed as: ZIGER DAVID · ZIGER DAVID H · ZIGER DAVID HOWARD
45 granted patents·2 pending applications·821 citations·filing 1987–2017
98Inventor score
Files withKONINKL PHILIPS ELECTRONICS NV11VLSI TECHNOLOGY INC9AT & T BELL LAB5NXP BV5INFINEON TECHNOLOGIES AG4
Top patents by PatentIndex Score
47 records- 0197US5607800AMethod and arrangement for characterizing micro-size patternsLUCENT TECHNOLOGIES INC·Filed 1995·Granted Mar 4, 1997·203 cites·19 claims
- 0290US5902703AMethod for measuring dimensional anomalies in photolithographed integrated circuits using overlay metrology, and masks thereforVLSI TECHNOLOGY INC·Filed 1997·Granted May 11, 1999·97 cites·22 claims
- 0388US6566016B1Apparatus and method for compensating critical dimension deviations across photomaskKONINKL PHILIPS ELECTRONICS NV·Filed 2000·Granted May 20, 2003·30 cites·23 claims
- 0483US10810339B1Determination of dimensional changes of features across mask pattern simulation fieldsSYNOPSYS INC·Filed 2017·Granted Oct 20, 2020·2 cites·20 claims
- 0581US6498640B1Method to measure alignment using latent image grating structuresKONINKL PHILIPS ELECTRONICS NV·Filed 1999·Granted Dec 24, 2002·44 cites·10 claims
- 0680US5962173AMethod for measuring the effectiveness of optical proximity correctionsVLSI TECHNOLOGY INC·Filed 1997·Granted Oct 5, 1999·50 cites·26 claims
- 0779US4814243AThermal processing of photoresist materialsAMERICAN TELEPHONE & TELEGRAPH·Filed 1987·Granted Mar 21, 1989·29 cites·10 claims
- 0875US6716649B2Method for improving substrate alignmentKONINKL PHILIPS ELECTRONICS NV·Filed 2002·Granted Apr 6, 2004·15 cites·9 claims
- 0974US7096127B2Measuring flare in semiconductor lithographyINFINEON TECHNOLOGIES AG·Filed 2004·Granted Aug 22, 2006·14 cites·32 claims
- 1074US6301008B1Arrangement and method for calibrating optical line shortening measurementsPHILIPS SEMICONDUCTOR INC·Filed 1999·Granted Oct 9, 2001·33 cites·23 claims
- 1174US5126289ASemiconductor lithography methods using an arc of organic materialAT & T BELL LAB·Filed 1990·Granted Jun 30, 1992·57 cites·3 claims
- 1271US7709166B2Measuring the effect of flare on line widthNXP BV·Filed 2009·Granted May 4, 2010·2 cites·13 claims
- 1370US6800403B2Techniques to characterize iso-dense effects for microdevice manufactureKONINKL PHILIPS ELECTRONICS NV·Filed 2002·Granted Oct 5, 2004·8 cites·12 claims
- 1468US6590219B1Apparatus and method for forming photoresist pattern with target critical dimensionKONINKL PHILIPS ELECTRONICS NV·Filed 2000·Granted Jul 8, 2003·9 cites·29 claims
- 1568US5976741AMethods for determining illumination exposure dosageVSLI TECHNOLOGY INC·Filed 1997·Granted Nov 2, 1999·26 cites·43 claims
- 1667US7099018B2Measurement of optical properties of radiation sensitive materialsINFINEON TECHNOLOGIES AG·Filed 2004·Granted Aug 29, 2006·6 cites·30 claims
- 1767US7054007B2Calibration wafer for a stepperKONINKL PHILIPS ELECTRONICS NV·Filed 2002·Granted May 30, 2006·7 cites·7 claims
- 1865US8717539B2Calibration of optical line shortening measurementsZIGER DAVID·Filed 2010·Granted May 6, 2014·1 cites·20 claims
- 1965US5472562AMethod of etching silicon nitrideAT & T CORP·Filed 1994·Granted Dec 5, 1995·35 cites·6 claims
- 2064US6613589B2Method for improving substrate alignmentKONINKL PHILIPS ELECTRONICS NV·Filed 2001·Granted Sep 2, 2003·7 cites·9 claims
- 2163US7541121B2Calibration of optical line shortening measurementsINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jun 2, 2009·5 cites·18 claims
- 2260US7842439B2Calibration of optical line shortening measurementsINFINEON TECHNOLOGIES AG·Filed 2009·Granted Nov 30, 2010·0 cites·16 claims
- 2360US6465322B2Semiconductor processing methods and structures for determining alignment during semiconductor wafer processingKONINKL PHILIPS ELECTRONICS NV·Filed 1998·Granted Oct 15, 2002·21 cites·49 claims
- 2459US5780208AMethod and mask design to minimize reflective notching effectsVLSI TECHNOLOGY INC·Filed 1996·Granted Jul 14, 1998·18 cites·6 claims
- 2559US5310457AMethod of integrated circuit fabrication including selective etching of silicon and silicon compoundsAT & T BELL LAB·Filed 1992·Granted May 10, 1994·28 cites·7 claims
- 2655US5982496AThin film thickness and optimal focus measuring using reflectivityVLSI TECHNOLOGY INC·Filed 1996·Granted Nov 9, 1999·16 cites·9 claims
- 2750US7537939B2System and method for characterizing lithography effects on a waferNXP BV·Filed 2004·Granted May 26, 2009·2 cites·11 claims
- 2848US10929177B2Managing resources for multiple trial distributed processing tasksSYNOPSYS INC·Filed 2017·Granted Feb 23, 2021·0 cites·20 claims
- 2947US6544859B2Semiconductor processing methods and structures for determining alignment during semiconductor wafer processingKONINKL PHILIPS ELECTRONICS NV·Filed 2001·Granted Apr 8, 2003·3 cites·5 claims
- 3047US6287972B1System and method for residue entrapment utilizing a polish and sacrificial fill for semiconductor fabricationPHILIPS SEMICONDUCTOR INC·Filed 1999·Granted Sep 11, 2001·13 cites·14 claims
- 3146US5830610AMethod for measuring alignment accuracy in a step and repeat system utilizing different intervalsVLSI TECHNOLOGY INC·Filed 1996·Granted Nov 3, 1998·9 cites·28 claims
- 3244US7556900B2Measuring the effect of flare on line widthNXP BV·Filed 2004·Granted Jul 7, 2009·0 cites·3 claims
- 3344US2006033917A1Calibration wafer for a stepperLEROUX PIERRE·Filed 2005·Application pending·0 cites
- 3441US7790480B2Method for determining relative swing curve amplitudeNXP BV·Filed 2004·Granted Sep 7, 2010·0 cites·15 claims
- 3541US7492465B2Method for determining optimal resist thicknessNXP BV·Filed 2004·Granted Feb 17, 2009·0 cites·19 claims
- 3640US5205867ASpin coating apparatus having a horizontally linearly movable wafer holderAT & T BELL LAB·Filed 1991·Granted Apr 27, 1993·7 cites·7 claims
- 3739US6591155B2Methods and apparatus for calculating alignment of layers during semiconductor processingKONINKL PHILIPS ELECTRONICS NV·Filed 2001·Granted Jul 8, 2003·0 cites·15 claims
- 3838US5762688AParticle removal waferVLSI TECHNOLOGY INC·Filed 1996·Granted Jun 9, 1998·6 cites·8 claims
- 3937US2003157415A1Apparatus and method for compensating critical dimension deviations across photomaskFiled 2003·Application pending·0 cites
- 4035US6372658B1Reducing contamination induced scumming, for semiconductor device, by ashingKONINKL PHILIPS ELECTRONICS NV·Filed 1998·Granted Apr 16, 2002·4 cites·6 claims
- 4135US6327513B1Methods and apparatus for calculating alignment of layers during semiconductor processingVLSI TECHNOLOGY INC·Filed 1998·Granted Dec 4, 2001·4 cites·23 claims
- 4235US6068955AMethods of inspecting for mask-defined, feature dimensional conformity between multiple masksVLSI TECHNOLOGY INC·Filed 1999·Granted May 30, 2000·3 cites·35 claims
- 4331US6309804B1Reducing contamination induced scumming, for semiconductor device, by acid treatmentPHILIPS SEMICONDUCTOR INC·Filed 1998·Granted Oct 30, 2001·2 cites·7 claims
- 4431US6063127AMethod for adaptive sampling for building accurate computer modelsVLSI TECHNOLOGY INC·Filed 1998·Granted May 16, 2000·2 cites·24 claims
- 4531US5272118APhotolithographic masking processAT & T BELL LAB·Filed 1992·Granted Dec 21, 1993·2 cites·4 claims
- 4630US5968690AThin film thickness and optimal focus measuring using reflectivityVSLI TECHNOLOGY INC·Filed 1997·Granted Oct 19, 1999·1 cites·10 claims
- 4730US5032492APhotolithographic masking process and apparatusAT & T BELL LAB·Filed 1989·Granted Jul 16, 1991·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →