Inventor · disambiguated record
Denis Amparo
Also filed as: AMPARO DENIS
10 granted patents·200 citations·filing 2011–2023
90Inventor score
Top patents by PatentIndex Score
10 records- 0197US8437818B1System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuitsHYPRES INC·Filed 2012·Granted May 7, 2013·75 cites·20 claims
- 0295US9130116B1System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuitsHYPRES INC·Filed 2013·Granted Sep 8, 2015·24 cites·20 claims
- 0394US10222416B1System and method for array diagnostics in superconducting integrated circuitHYPRES INC·Filed 2016·Granted Mar 5, 2019·11 cites·23 claims
- 0494US8301214B1System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuitsTOLPYGO SERGEY K·Filed 2011·Granted Oct 30, 2012·69 cites·35 claims
- 0593US10833243B1System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuitsHYPRES INC·Filed 2017·Granted Nov 10, 2020·8 cites·20 claims
- 0692US9741920B1System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuitsHYPRES INC·Filed 2015·Granted Aug 22, 2017·8 cites·20 claims
- 0791US11711985B2System and method for superconducting multi-chip moduleSEEQC INC·Filed 2021·Granted Jul 25, 2023·2 cites·20 claims
- 0879US11121302B2System and method for superconducting multi-chip moduleSEEQC INC·Filed 2019·Granted Sep 14, 2021·2 cites·21 claims
- 0976US12317757B2System and method for superconducting multi-chip moduleSEEQC INC·Filed 2023·Granted May 27, 2025·0 cites·22 claims
- 1070US10505097B1System and method for array diagnostics in superconducting integrated circuitHYPRES INC·Filed 2019·Granted Dec 10, 2019·1 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →