Inventor · disambiguated record
Dev Balaraman
Also filed as: BALARAMAN DEV
0 granted patents·3 pending applications·0 citations·filing 2022–2023
Technology areasH10W
Files withWOLFSPEED INC3
Top patents by PatentIndex Score
3 records- 0147US2023378010A1Power semiconductor devices having moisture barriersWOLFSPEED INC·Filed 2022·Application pending·0 cites
- 0240US2024321663A1High-performance stress buffer die-coat and devices and processes implementing the sameWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 0340US2024321659A1Die-coat material configured to enhance device reliability and devices and processes implementing the sameWOLFSPEED INC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →