Inventor · disambiguated record
Dennis Lee Conner
Also filed as: CONNER DENNIS LEE
11 granted patents·33 citations·filing 2012–2023
85Inventor score
Top patents by PatentIndex Score
11 records- 0192US9484210B2Semiconductor die singulation methodSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Nov 1, 2016·7 cites·44 claims
- 0290US8664089B1Semiconductor die singulation methodBURGHOUT WILLIAM F·Filed 2012·Granted Mar 4, 2014·19 cites·20 claims
- 0385US9034733B2Semiconductor die singulation methodSEMICONDUCTOR COMPONENTS IND·Filed 2014·Granted May 19, 2015·5 cites·20 claims
- 0480US9847219B2Semiconductor die singulation methodSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Dec 19, 2017·2 cites·28 claims
- 0575US11984388B2Semiconductor package structures and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted May 14, 2024·0 cites·20 claims
- 0669US11710686B2Semiconductor package structures and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Jul 25, 2023·0 cites·20 claims
- 0758US11217515B2Semiconductor package structures and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Jan 4, 2022·0 cites·18 claims
- 0857US10522448B2Single or multi chip module package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Dec 31, 2019·0 cites·18 claims
- 0956US9558968B2Single or multi chip module package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2014·Granted Jan 31, 2017·0 cites·16 claims
- 1054US9870986B2Single or multi chip module package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Jan 16, 2018·0 cites·17 claims
- 1146US9911684B1Holes and dimples to control solder flowSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Mar 6, 2018·0 cites·18 claims
Join the waitlist — get patent alerts
Get an alert when Dennis Lee Conner files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →