Inventor · disambiguated record
Debjit Datta
Also filed as: DATTA DEBJIT
1 granted patent·2 pending applications·0 citations·filing 2022–2025
13Inventor score
Technology areasH10W
Files withMICRON TECHNOLOGY INC3
Top patents by PatentIndex Score
3 records- 0168US2025385205A1Modular construction of hybrid-bonded semiconductor die assemblies and related systems and methodsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0265US12278202B2Modular construction of hybrid-bonded semiconductor die assemblies and related systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Apr 15, 2025·0 cites·20 claims
- 0357US2024282731A1Hybrid bonding for semiconductor device assembliesMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →