Inventor · disambiguated record
Deep C. Dumka
Also filed as: DUMKA DEEP · DUMKA DEEP C
13 granted patents·1 pending application·240 citations·filing 2008–2023
89Inventor score
Top patents by PatentIndex Score
14 records- 0197US9337278B1Gallium nitride on high thermal conductivity material device and methodTRIQUINT SEMICONDUCTOR INC·Filed 2015·Granted May 10, 2016·200 cites·23 claims
- 0294US11626340B2Integrated circuit (IC) package with embedded heat spreader in a redistribution layer (RDL)QORVO US INC·Filed 2019·Granted Apr 11, 2023·9 cites·22 claims
- 0387US8350295B1Device structure including high-thermal-conductivity substrateTRIQUINT SEMICONDUCTOR INC·Filed 2008·Granted Jan 8, 2013·14 cites·10 claims
- 0486US8946894B2Package for high-power semiconductor devicesTRIQUINT SEMICONDUCTOR INC·Filed 2013·Granted Feb 3, 2015·6 cites·8 claims
- 0582US11145547B2Semiconductor chip suitable for 2.5D and 3D packaging integration and methods of forming the sameQORVO US INC·Filed 2019·Granted Oct 12, 2021·2 cites·24 claims
- 0678US11948838B2Semiconductor chip suitable for 2.5D and 3D packaging integration and methods of forming the sameQORVO US INC·Filed 2023·Granted Apr 2, 2024·0 cites·23 claims
- 0776US8754496B2Field effect transistor having a plurality of field platesTSERNG HUA-QUEN·Filed 2009·Granted Jun 17, 2014·9 cites·20 claims
- 0874US11929300B2Method for packaging an integrated circuit (IC) package with embedded heat spreader in a redistribution layer (RDL)QORVO US INC·Filed 2023·Granted Mar 12, 2024·0 cites·18 claims
- 0972US11610814B2Semiconductor chip suitable for 2.5D and 3D packaging integration and methods of forming the sameQORVO US INC·Filed 2021·Granted Mar 21, 2023·0 cites·22 claims
- 1062US11289377B2Semiconductor chip suitable for 2.5D and 3D packaging integration and methods of forming the sameQORVO US INC·Filed 2019·Granted Mar 29, 2022·0 cites·21 claims
- 1158US9559034B2Package for high-power semiconductor devicesTRIQUINT SEMICONDUCTOR INC·Filed 2014·Granted Jan 31, 2017·0 cites·14 claims
- 1254US11127665B2Module assemblyQORVO US INC·Filed 2019·Granted Sep 21, 2021·0 cites·17 claims
- 1352US2023178486A1Backside metallization for semiconductor assemblyQORVO US INC·Filed 2022·Application pending·0 cites
- 1450US10403568B2Module assemblyQORVO US INC·Filed 2017·Granted Sep 3, 2019·0 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →