Inventor · disambiguated record
Deok Su Han
Also filed as: HAN DEOK SU
9 granted patents·16 pending applications·10 citations·filing 2006–2024
76Inventor score
Files withSK ENPULSE CO LTD19TECHNO SEMICHEM CO LTD3HAN DEOK-SU1SKC ENPULSE CO LTD1SKC SOLMICS CO LTD1
Top patents by PatentIndex Score
25 records- 0181US8840798B2Chemical mechanical polishing slurry composition and method for producing semiconductor device using the sameHAN DEOK-SU·Filed 2011·Granted Sep 23, 2014·10 cites·11 claims
- 0267US12441911B2Composition for semiconductor processing and polishing method of semiconductor device using the sameSK ENPULSE CO LTD·Filed 2023·Granted Oct 14, 2025·0 cites·16 claims
- 0359US12480021B2Composition for semiconductor process, method for preparing the same and method for preparing semiconductor device using the sameSK ENPULSE CO LTD·Filed 2023·Granted Nov 25, 2025·0 cites·13 claims
- 0459US12116503B2Polishing composition for semiconductor process and method for manufacturing semiconductor device by using the sameSK ENPULSE CO LTD·Filed 2022·Granted Oct 15, 2024·0 cites·19 claims
- 0559US2025145860A1Polishing composition for semiconductor process and manufacturing method of substrate using the sameSK ENPULSE CO LTD·Filed 2024·Application pending·0 cites
- 0659US2025145861A1Polishing composition for a semiconductor process and manufacturing method of substrate using the sameSK ENPULSE CO LTD·Filed 2024·Application pending·0 cites
- 0759US2025136842A1Polishing composition for semiconductor process and method of manufacturing substrate using sameSK ENPULSE CO LTD·Filed 2024·Application pending·0 cites
- 0858US12444611B2Semiconductor process polishing composition and polishing method of substrate applied with polishing compositionSK ENPULSE CO LTD·Filed 2021·Granted Oct 14, 2025·0 cites·13 claims
- 0958US2025145857A1Polishing composition for semiconductor process and method of manufacturing substrate using sameSK ENPULSE CO LTD·Filed 2024·Application pending·0 cites
- 1058US2025115786A1Polishing composition for semiconductor process and polishing method of substrate using the sameSK ENPULSE CO LTD·Filed 2024·Application pending·0 cites
- 1157US2024274439A1Polishing composition for semiconductor process and method for polishing a substrate using the sameSK ENPULSE CO LTD·Filed 2024·Application pending·0 cites
- 1257US2025115787A1Polishing composition for semiconductor process and polishing method of substrate using the sameSK ENPULSE CO LTD·Filed 2024·Application pending·0 cites
- 1356US12448543B2Polishing composition for semiconductor process and manufacturing method for polished articleSK ENPULSE CO LTD·Filed 2022·Granted Oct 21, 2025·0 cites·13 claims
- 1452US2024218251A1Polishing composition for semiconductor processing and method of polishing a substrateSK ENPULSE CO LTD·Filed 2024·Application pending·0 cites
- 1552US2023407135A1Composition for semiconductor processing and method of fabricating semiconductor device using the sameSK ENPULSE CO LTD·Filed 2023·Application pending·0 cites
- 1649US12486428B2Polishing pad and method for manufacturing semiconductor device using sameSK ENPULSE CO LTD·Filed 2022·Granted Dec 2, 2025·0 cites·13 claims
- 1748US12110421B2Composition for semiconductor processing and method of fabricating semiconductor device using the sameSK ENPULSE CO LTD·Filed 2022·Granted Oct 8, 2024·0 cites·13 claims
- 1848US2022325139A1Polishing composition for semiconductor process and method for manufacturing semiconductor device by using the sameSKC SOLMICS CO LTD·Filed 2022·Application pending·0 cites
- 1947US12444616B2Polishing composition for semiconductor processing polishing composition preparation method, and semiconductor device manufacturing method to which polishing composition is appliedSK ENPULSE CO LTD·Filed 2021·Granted Oct 14, 2025·0 cites·10 claims
- 2046US2023332014A1Polishing compostion for semiconductor process, manufacturing method of polishing composition and method for manufacturing semiconductor device by using the sameSK ENPULSE CO LTD·Filed 2021·Application pending·0 cites
- 2146US2024043718A1Polishing composition for semiconductor processing,method for preparing polishing composition, and method for manufacturing semiconductor element to which polishing composition is appliedSK ENPULSE CO LTD·Filed 2021·Application pending·0 cites
- 2245US2024043719A1Polishing composition for semiconductor processing,method for preparing polishing composition, and method for manufacturing semiconductor element to which polishing composition is appliedSKC ENPULSE CO LTD·Filed 2021·Application pending·0 cites
- 2332US2009298289A1Chemical Mechanical Polishing Composition for Copper Comprising ZeoliteTECHNO SEMICHEM CO LTD·Filed 2007·Application pending·0 cites
- 2430US2011045741A1Auto-Stopping Abrasive Composition for Polishing High Step Height Oxide LayerTECHNO SEMICHEM CO LTD·Filed 2006·Application pending·0 cites
- 2528US2010176335A1CMP Slurry Composition for Copper Damascene ProcessTECHNO SEMICHEM CO LTD·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →