Inventor · disambiguated record
Detlef Houdeau
Also filed as: HOUDEAU DETLEF
24 granted patents·2 pending applications·1,486 citations·filing 1992–2009
97Inventor score
Files withINFINEON TECHNOLOGIES AG11SIEMENS AG11INFINEON TECHNOLOGIE AG1PAV CARD GMBH1PUESCHNER FRANK1
Top patents by PatentIndex Score
26 records- 0195US5809633AMethod for producing a smart card module for contactless smart cardsSIEMENS AG·Filed 1997·Granted Sep 22, 1998·214 cites·3 claims
- 0294US6522773B1Fingertip sensor with integrated key switchSIEMENS AG·Filed 1999·Granted Feb 18, 2003·90 cites·5 claims
- 0394US6190942B1Method and connection arrangement for producing a smart cardPAV CARD GMBH·Filed 1997·Granted Feb 20, 2001·285 cites·18 claims
- 0490US6095423AMethod of producing a smart card module, a smart card module produced by the method, and a combination smart card containing the smart card moduleSIEMENS AG·Filed 1999·Granted Aug 1, 2000·134 cites·16 claims
- 0588US6305609B1Data card, process for manufacturing a data card and apparatus for manufacturing a data cardINFINEON TECHNOLOGIES AG·Filed 1998·Granted Oct 23, 2001·110 cites·27 claims
- 0684US6347040B1Sensor device for sensing biometric characteristics, in particular finger minutiaeINFINEON TECHNOLOGIES AG·Filed 2000·Granted Feb 12, 2002·161 cites·6 claims
- 0782US6848617B1Smart card module for biometric sensorsINFINEON TECHNOLOGIES AG·Filed 2000·Granted Feb 1, 2005·61 cites·8 claims
- 0882US6288904B1Chip module, in particular for implantation in a smart card bodyINFINEON TECHNOLOGIES AG·Filed 1999·Granted Sep 11, 2001·67 cites·17 claims
- 0979US7012531B2Product label, method of producing product labels and method for identifying products in a contactless and forgery-proof mannerINFINEON TECHNOLOGIES AG·Filed 2002·Granted Mar 14, 2006·28 cites·31 claims
- 1078US6188580B1Smart card and semiconductor chip for use in a smart cardINFINEON TECHNOLOGIES AG·Filed 1999·Granted Feb 13, 2001·59 cites·16 claims
- 1170US6191951B1Smart card module and smart card including a smart card moduleINFINEON TECHNOLOGIES AG·Filed 1999·Granted Feb 20, 2001·39 cites·12 claims
- 1268US5982628ACircuit configuration having a smart card module and a coil connected theretoSIEMENS AG·Filed 1997·Granted Nov 9, 1999·36 cites·8 claims
- 1363US6535262B2Display unit for chip cards with folded sheet a method for manufacturing such a display unitINFINEON TECHNOLOGIES AG·Filed 2002·Granted Mar 18, 2003·8 cites·4 claims
- 1461US6326683B1Carrier element for a semiconductor chipSIEMENS AG·Filed 1998·Granted Dec 4, 2001·32 cites·13 claims
- 1560US6375083B2Smart cardINFINEON TECHNOLOGIES AG·Filed 1999·Granted Apr 23, 2002·25 cites·8 claims
- 1660US6209790B1Data medium in card form and lead frame for use in such a data mediumSIEMENS AG·Filed 1996·Granted Apr 3, 2001·31 cites·5 claims
- 1759US6088901AMethod for producing a carrier element for semiconductor chipsSIEMENS AG·Filed 1998·Granted Jul 18, 2000·24 cites·9 claims
- 1855US2009218667A1Smart cards and methods for producing a smart cardPUESCHNER FRANK·Filed 2009·Application pending·0 cites
- 1951US5896111AAntenna coilSIEMENS AG·Filed 1997·Granted Apr 20, 1999·17 cites·5 claims
- 2050US5883429AChip coverSIEMENS AG·Filed 1997·Granted Mar 16, 1999·19 cites·16 claims
- 2148US5623102AThree wafer semiconductor pressure-difference sensor and method for manufacture separating middle wafer into conducting diaphragm and webSIEMENS AG·Filed 1992·Granted Apr 22, 1997·17 cites·13 claims
- 2244US6186008B1Semiconductor sensor componentSIEMENS AG·Filed 1999·Granted Feb 13, 2001·10 cites·16 claims
- 2341US6992898B2Smart-card module with an anisotropically conductive substrate filmINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jan 31, 2006·0 cites·7 claims
- 2441US2003205622A1Machine-readable labelFiled 2003·Application pending·0 cites
- 2534US6218727B1Wafer frameINFINEON TECHNOLOGIE AG·Filed 1999·Granted Apr 17, 2001·13 cites·9 claims
- 2633US6421248B1Chip card moduleINFINEON TECHNOLOGIES AG·Filed 1999·Granted Jul 16, 2002·6 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →