Inventor · disambiguated record
Deok-Hoon Kim
Also filed as: KIM DEOK HOON
13 granted patents·3 pending applications·310 citations·filing 2000–2011
93Inventor score
Files withOPTOPAC INC9KIM DEOK-HOON3ELENIUS PETER1FLIP CHIP TECHNOLOGIES L L C1FLIPCHIP INTERNAT LLC1
Top patents by PatentIndex Score
16 records- 0196US7141869B2Electronic package for image sensor, and the packaging method thereofOPTOPAC INC·Filed 2005·Granted Nov 28, 2006·74 cites·15 claims
- 0293US6578755B1Polymer collar for solder bumpsFLIP CHIP TECHNOLOGIES L L C·Filed 2000·Granted Jun 17, 2003·88 cites·37 claims
- 0388US7384818B2Electronic package for image sensor, and the packaging method thereofOPTOPAC INC·Filed 2006·Granted Jun 10, 2008·17 cites·5 claims
- 0482US6864116B1Electronic package of photo-sensing semiconductor devices, and the fabrication and assembly thereofOPTOPAC INC·Filed 2003·Granted Mar 8, 2005·32 cites·16 claims
- 0580US6943423B2Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereofOPTOPAC INC·Filed 2004·Granted Sep 13, 2005·27 cites·11 claims
- 0677US7291518B2Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereofOPTOPAC INC·Filed 2005·Granted Nov 6, 2007·7 cites·12 claims
- 0775US8486318B2Fiber, fiber aggregate and adhesive having the sameKIM DEOK HOON·Filed 2011·Granted Jul 16, 2013·2 cites·19 claims
- 0873US7122874B2Electronic package having a sealing structure on predetermined area, and the method thereofOPTOPAC INC·Filed 2004·Granted Oct 17, 2006·17 cites·16 claims
- 0970US6943424B1Electronic package having a patterned layer on backside of its substrate, and the fabrication thereofOPTOPAC INC·Filed 2004·Granted Sep 13, 2005·17 cites·20 claims
- 1068US7038287B2Electronic package of photo-sensing semiconductor devices, and the fabrication and assembly thereofOPTOPAC INC·Filed 2004·Granted May 2, 2006·14 cites·16 claims
- 1166US8487437B2Electronic device package and method for fabricating the sameELENIUS PETER·Filed 2010·Granted Jul 16, 2013·3 cites·15 claims
- 1262US7494848B2Flip-chip packaging of a photo-sensor die on a transparent substrateOPTOPAC INC·Filed 2006·Granted Feb 24, 2009·2 cites·5 claims
- 1357US7126164B2Wafer-level moat structuresFLIPCHIP INTERNAT LLC·Filed 2003·Granted Oct 24, 2006·10 cites·24 claims
- 1448US2012231689A1Fiber, fiber aggregate and adhesive having the sameKIM DEOK HOON·Filed 2011·Application pending·0 cites
- 1545US2010237498A1Package for semiconductor device and packaging method thereofOPTOPAC CO LTD·Filed 2008·Application pending·0 cites
- 1634US2006043513A1Method of making camera module in wafer levelKIM DEOK-HOON·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →