Inventor · disambiguated record
Denny Kwon
Also filed as: KWON DENNY
2 granted patents·0 citations·filing 2018–2022
28Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0165US11764133B2Tape carrier assemblies having an integrated adhesive filmDAEWON SEMICONDUCTOR PACKAGING IND COMPANY·Filed 2022·Granted Sep 19, 2023·0 cites·16 claims
- 0250US11362025B2Tape carrier assemblies having an integrated adhesive filmDAEWON SEMICONDUCTOR PACKAGING IND COMPANY·Filed 2018·Granted Jun 14, 2022·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →