Inventor · disambiguated record

Dei-Cheng Liu

Also filed as: LIU DEI-CHENG

1 granted patent·1 pending application·0 citations·filing 2022–2023

3Inventor score

Technology areasH10W

Files withTONG HSING ELECTRONIC INDUSTRIES LTD2

Top patents by PatentIndex Score

2 records

0144US12500092B2Chip package structure and method for fabricating the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2022·Granted Dec 16, 2025·0 cites·7 claims
0241US2024088049A1Chip package structure and method for fabricating the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →