Inventor · disambiguated record
Deviprasad Malladi
Also filed as: MALLADI DEVIPRASAD
20 granted patents·4 pending applications·720 citations·filing 1993–2011
96Inventor score
Top patents by PatentIndex Score
24 records- 0188US7301227B1Package lid or heat spreader for microprocessor packagesSUN MICROSYSTEMS INC·Filed 2005·Granted Nov 27, 2007·18 cites·20 claims
- 0288US5629240AMethod for direct attachment of an on-chip bypass capacitor in an integrated circuitSUN MICROSYSTEMS INC·Filed 1995·Granted May 13, 1997·98 cites·20 claims
- 0386US5528083AThin film chip capacitor for electrical noise reduction in integrated circuitsSUN MICROSYSTEMS INC·Filed 1994·Granted Jun 18, 1996·118 cites·30 claims
- 0484US5972736AIntegrated circuit package and methodSUN MICROSYSTEMS INC·Filed 1998·Granted Oct 26, 1999·81 cites·8 claims
- 0579US7939364B2Optimized lid attach process for thermal management and multi-surface compliant heat removalORACLE AMERICA INC·Filed 2008·Granted May 10, 2011·7 cites·7 claims
- 0679US5831333AIntegrated junction temperature sensor/package design and method of implementing sameSUN MICROSYSTEMS INC·Filed 1996·Granted Nov 3, 1998·61 cites·23 claims
- 0777US5701085AApparatus for testing flip chip or wire bond integrated circuitsSUN MICROSYSTEMS INC·Filed 1995·Granted Dec 23, 1997·72 cites·17 claims
- 0876US6944025B2EMI shielding apparatusSUN MICROSYSTEMS INC·Filed 2003·Granted Sep 13, 2005·26 cites·17 claims
- 0974US6436737B1Method for reducing soft error rates in semiconductor devicesSUN MICROSYSTEMS INC·Filed 2000·Granted Aug 20, 2002·20 cites·35 claims
- 1073US5367193ALow cost, thermally efficient, and surface mountable semiconductor package for a high applied power VLSI dieSUN MICROSYSTEMS INC·Filed 1993·Granted Nov 22, 1994·50 cites·14 claims
- 1170US6472900B1Efficient device debug systemSUN MICROSYSTEMS INC·Filed 2001·Granted Oct 29, 2002·16 cites·20 claims
- 1270US5780930AMethod for direct attachment of an on-chip bypass capacitor in an integrated circuitSUN MICROSYSTEMS INC·Filed 1997·Granted Jul 14, 1998·37 cites·20 claims
- 1369US6637506B2Multi-material heat spreaderSUN MICROSYSTEMS INC·Filed 2002·Granted Oct 28, 2003·16 cites·28 claims
- 1457US6246252B1Efficient debug package designSUN MICROSYSTEMS INC·Filed 1999·Granted Jun 12, 2001·21 cites·14 claims
- 1556US5598035AIntegrated circuit package with external storage capacitor for improved signal quality for sensitive integrated circuit elementsSUN MICROSYSTEMS INC·Filed 1996·Granted Jan 28, 1997·22 cites·10 claims
- 1655US6636825B1Component level, CPU-testable, multi-chip package using grid arraysSUN MICROSYSTEMS INC·Filed 1999·Granted Oct 21, 2003·19 cites·5 claims
- 1753US5734554AHeat sink and fan for cooling CPU chipSUN MICROSYSTEMS INC·Filed 1996·Granted Mar 31, 1998·21 cites·9 claims
- 1848US6351389B1Device and method for packaging an electronic deviceSUN MICROSYSTEMS INC·Filed 1996·Granted Feb 26, 2002·15 cites·23 claims
- 1946US6727193B2Apparatus and methods for enhancing thermal performance of integrated circuit packagesSUN MICROSYSTEMS INC·Filed 2002·Granted Apr 27, 2004·2 cites·16 claims
- 2043US8283204B2Optimized lid attach process for thermal management and multi-surface compliant heat removalGEKTIN VADIM·Filed 2011·Granted Oct 9, 2012·0 cites·6 claims
- 2140US2011256925A1Detection of Improper Bets in Real-Time Wagering SystemsSCHIPANI JOHN·Filed 2011·Application pending·0 cites
- 2237US2002093530A1Automatic filling and submission of completed formsFiled 2001·Application pending·0 cites
- 2336US2004065410A1Method and apparatus for dispensing interface materialsSUN MICROSYSTEMS INC·Filed 2002·Application pending·0 cites
- 2434US2004042178A1Heat spreader with surface cavityFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →