Inventor · disambiguated record
Debendra Mallik
Also filed as: MALLIK DEBENDRA
134 granted patents·65 pending applications·2,124 citations·filing 1988–2025
99Inventor score
Top patents by PatentIndex Score
199 records- 0199US9269701B2Localized high density substrate routingINTEL CORP·Filed 2015·Granted Feb 23, 2016·49 cites·20 claims
- 0298US11581235B2IC package including multi-chip unit with bonded integrated heat spreaderINTEL CORP·Filed 2021·Granted Feb 14, 2023·4 cites·20 claims
- 0398US8901748B2Direct external interconnect for embedded interconnect bridge packageMANUSHAROW MATHEW J·Filed 2013·Granted Dec 2, 2014·122 cites·11 claims
- 0498US7345361B2Stackable integrated circuit packagingINTEL CORP·Filed 2003·Granted Mar 18, 2008·307 cites·13 claims
- 0597US11824018B2Heterogeneous nested interposer package for IC chipsINTEL CORP·Filed 2022·Granted Nov 21, 2023·3 cites·20 claims
- 0697US11749577B2IC package including multi-chip unit with bonded integrated heat spreaderINTEL CORP·Filed 2022·Granted Sep 5, 2023·2 cites·20 claims
- 0797US11742261B2Nested architectures for enhanced heterogeneous integrationINTEL CORP·Filed 2022·Granted Aug 29, 2023·2 cites·20 claims
- 0897US10847467B2Power-delivery methods for embedded multi-die interconnect bridges and methods of assembling sameINTEL CORP·Filed 2019·Granted Nov 24, 2020·21 cites·20 claims
- 0997US9679843B2Localized high density substrate routingINTEL CORP·Filed 2016·Granted Jun 13, 2017·17 cites·20 claims
- 1097US9210809B2Reduced PTH pad for enabling core routing and substrate layer count reductionMALLIK DEBENDRA·Filed 2013·Granted Dec 8, 2015·37 cites·13 claims
- 1196US11011448B2IC package including multi-chip unit with bonded integrated heat spreaderINTEL CORP·Filed 2019·Granted May 18, 2021·9 cites·18 claims
- 1296US9136236B2Localized high density substrate routingSTARKSTON ROBERT·Filed 2012·Granted Sep 15, 2015·69 cites·16 claims
- 1396US4891687AMulti-layer molded plastic IC packageINTEL CORP·Filed 1989·Granted Jan 2, 1990·170 cites·10 claims
- 1494US12412842B2Microelectronic structures including bridgesINTEL CORP·Filed 2023·Granted Sep 9, 2025·2 cites·20 claims
- 1594US10366951B2Localized high density substrate routingINTEL CORP·Filed 2017·Granted Jul 30, 2019·7 cites·20 claims
- 1694US9899238B2Low cost package warpage solutionINTEL CORP·Filed 2014·Granted Feb 20, 2018·11 cites·13 claims
- 1794US9570883B2Photonic package architectureZARBOCK EDWARD A·Filed 2011·Granted Feb 14, 2017·43 cites·11 claims
- 1894US9129958B23D integrated circuit package with window interposerMALLIK DEBENDRA·Filed 2011·Granted Sep 8, 2015·17 cites·24 claims
- 1994US7187068B2Methods and apparatuses for providing stacked-die devicesINTEL CORP·Filed 2004·Granted Mar 6, 2007·71 cites·20 claims
- 2094US5519580AMethod of controlling solder ball size of BGA IC componentsINTEL CORP·Filed 1994·Granted May 21, 1996·207 cites·13 claims
- 2194US2025391754A1Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2025·Application pending·0 cites
- 2293US11557541B2Interconnect architecture with silicon interposer and EMIBINTEL CORP·Filed 2018·Granted Jan 17, 2023·6 cites·25 claims
- 2393US11515248B2Localized high density substrate routingINTEL CORP·Filed 2020·Granted Nov 29, 2022·2 cites·22 claims
- 2493US11164818B2Inorganic-based embedded-die layers for modular semiconductive devicesINTEL CORP·Filed 2019·Granted Nov 2, 2021·7 cites·19 claims
- 2593US5210939ALead grid array integrated circuitINTEL CORP·Filed 1992·Granted May 18, 1993·141 cites·21 claims
- 2693US4835120AMethod of making a multilayer molded plastic IC packageMALLIK DEBENDRA·Filed 1988·Granted May 30, 1989·118 cites·2 claims
- 2792US11735552B2Microelectronic package with solder array thermal interface material (SA-TIM)INTEL CORP·Filed 2019·Granted Aug 22, 2023·6 cites·20 claims
- 2891US11430724B2Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2017·Granted Aug 30, 2022·5 cites·24 claims
- 2991US10741419B2Low cost package warpage solutionINTEL CORP·Filed 2019·Granted Aug 11, 2020·4 cites·20 claims
- 3091US2024421073A1Localized high density substrate routingINTEL CORP·Filed 2024·Application pending·0 cites
- 3191US2025323145A1Localized high density substrate routingINTEL CORP·Filed 2025·Application pending·0 cites
- 3290US7456047B2Thermally enhanced electronic flip-chip packaging with external-connector-side die and methodINTEL CORP·Filed 2007·Granted Nov 25, 2008·15 cites·18 claims
- 3390US2025323114A1Ic package including multi-chip unit with bonded integrated heat spreaderINTEL CORP·Filed 2025·Application pending·0 cites
- 3489US2025096009A1Low cost package warpage solutionINTEL CORP·Filed 2024·Application pending·0 cites
- 3589US2025336810A1Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridgeINTEL CORP·Filed 2025·Application pending·0 cites
- 3689US2025087548A1Ic package including multi-chip unit with bonded integrated heat spreaderINTEL CORP·Filed 2024·Application pending·0 cites
- 3788US11387175B2Interposer package-on-package (PoP) with solder array thermal contactsINTEL CORP·Filed 2018·Granted Jul 12, 2022·6 cites·16 claims
- 3888US6992891B2Metal ball attachment of heat dissipation devicesINTEL CORP·Filed 2003·Granted Jan 31, 2006·58 cites·18 claims
- 3987US11935808B2IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnectsINTEL CORP·Filed 2020·Granted Mar 19, 2024·2 cites·22 claims
- 4087US7268425B2Thermally enhanced electronic flip-chip packaging with external-connector-side die and methodINTEL CORP·Filed 2003·Granted Sep 11, 2007·31 cites·12 claims
- 4187US5557502AStructure of a thermally and electrically enhanced plastic ball grid array packageINTEL CORP·Filed 1995·Granted Sep 17, 1996·105 cites·16 claims
- 4286US10490503B2Power-delivery methods for embedded multi-die interconnect bridges and methods of assembling sameINTEL CORP·Filed 2018·Granted Nov 26, 2019·4 cites·26 claims
- 4385US12422615B2Nested glass packaging architecture for hybrid electrical and optical communication devicesINTEL CORP·Filed 2021·Granted Sep 23, 2025·1 cites·11 claims
- 4485US12243806B2Nested architectures for enhanced heterogeneous integrationINTEL CORP·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
- 4585US12199048B2Heterogeneous nested interposer package for IC chipsINTEL CORP·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
- 4685US12183596B2Low cost package warpage solutionINTEL CORP·Filed 2023·Granted Dec 31, 2024·0 cites·18 claims
- 4785US11694959B2Multi-die ultrafine pitch patch architecture and method of makingINTEL CORP·Filed 2019·Granted Jul 4, 2023·3 cites·25 claims
- 4885US9530758B23D integrated circuit package with through-mold first level interconnectsMALLIK DEBENDRA·Filed 2015·Granted Dec 27, 2016·4 cites·16 claims
- 4984US12476174B2Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 5084US12272656B2Heterogeneous nested interposer package for IC chipsINTEL CORP·Filed 2023·Granted Apr 8, 2025·0 cites·20 claims
Showing the top 50 of 199 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →