Inventor · disambiguated record
Dennis Meddles
Also filed as: MEDDLES DENNIS
4 granted patents·144 citations·filing 1981–1987
80Inventor score
Technology areasH10W
Files withINT RECTIFIER CORP4
Top patents by PatentIndex Score
4 records- 0179US4641418AMolding process for semiconductor devices and lead frame structure thereforINT RECTIFIER CORP·Filed 1985·Granted Feb 10, 1987·61 cites·12 claims
- 0274US4556896ALead frame structureINT RECTIFIER CORP·Filed 1982·Granted Dec 3, 1985·42 cites·13 claims
- 0351US4642419AFour-leaded dual in-line package module for semiconductor devicesINT RECTIFIER CORP·Filed 1981·Granted Feb 10, 1987·18 cites·12 claims
- 0450US4845545ALow profile semiconductor packageINT RECTIFIER CORP·Filed 1987·Granted Jul 4, 1989·23 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →