Inventor · disambiguated record
Dennis Brian Miller
Also filed as: MILLER DENNIS · MILLER DENNIS B · MILLER DENNIS BRIAN
10 granted patents·507 citations·filing 1990–1999
92Inventor score
Top patents by PatentIndex Score
10 records- 0193US5120678AElectrical component package comprising polymer-reinforced solder bump interconnectionMOTOROLA INC·Filed 1990·Granted Jun 9, 1992·227 cites·7 claims
- 0284US5749614AVacuum pickup tool for placing balls in a customized patternMOTOROLA INC·Filed 1995·Granted May 12, 1998·75 cites·12 claims
- 0372US5898215AMicroelectronic assembly with connection to a buried electrical element, and method for forming sameMOTOROLA INC·Filed 1996·Granted Apr 27, 1999·40 cites·20 claims
- 0470US5848466AMethod for forming a microelectronic assemblyMOTOROLA INC·Filed 1996·Granted Dec 15, 1998·34 cites·18 claims
- 0570US5829668AMethod for forming solder bumps on bond padsMOTOROLA CORP·Filed 1996·Granted Nov 3, 1998·43 cites·14 claims
- 0669US5429292ATin bismuth solder paste, and method using paste to form connection having improved high temperature propertiesMOTOROLA INC·Filed 1994·Granted Jul 4, 1995·27 cites·6 claims
- 0765US5325451AModular optical waveguide and method for makingMOTOROLA INC·Filed 1993·Granted Jun 28, 1994·28 cites·13 claims
- 0854US5389160ATin bismuth solder paste, and method using paste to form connection having improved high temperature propertiesMOTOROLA INC·Filed 1993·Granted Feb 14, 1995·14 cites·4 claims
- 0943US5856912AMicroelectronic assembly for connection to an embedded electrical element, and method for forming sameMOTOROLA INC·Filed 1997·Granted Jan 5, 1999·12 cites·17 claims
- 1038US6200829B1Microelectronic assembly with connection to a buried electrical element, and method for forming sameMOTOROLA INC·Filed 1999·Granted Mar 13, 2001·7 cites·9 claims
Join the waitlist — get patent alerts
Get an alert when Dennis Brian Miller files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →