Inventor · disambiguated record
Dean Monthei
Also filed as: MONTHEI DEAN · MONTHEI DEAN L
2 granted patents·2 pending applications·41 citations·filing 2004–2008
63Inventor score
Top patents by PatentIndex Score
4 records- 0190US8030770B1Substrateless packageTRIQUINT SEMICONDUCTOR INC·Filed 2008·Granted Oct 4, 2011·30 cites·13 claims
- 0268US8274162B2Apparatus and method for reduced delamination of an integrated circuit moduleMONTHEI DEAN L·Filed 2007·Granted Sep 25, 2012·11 cites·19 claims
- 0334US2006057777A1Separating die on a substrate to reduce backside chippingHOWELL WILLIAM C·Filed 2004·Application pending·0 cites
- 0433US2007163802A1Electronic package including an electromagnetic shieldTRIQUINT SEMICONDUCTORS INC·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →