Inventor · disambiguated record
Dewali Ray
Also filed as: RAY DEWALI
8 granted patents·1 pending application·45 citations·filing 2007–2019
83Inventor score
Top patents by PatentIndex Score
9 records- 0191US8084854B2Pass-through 3D interconnect for microelectronic dies and associated systems and methodsPRATT DAVID S·Filed 2007·Granted Dec 27, 2011·22 cites·13 claims
- 0290US8503156B2Methods of processing semiconductor substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded theretoRAY DEWALI·Filed 2011·Granted Aug 6, 2013·15 cites·13 claims
- 0379US9209158B2Pass-through 3D interconnect for microelectronic dies and associated systems and methodsPRATT DAVID S·Filed 2011·Granted Dec 8, 2015·4 cites·14 claims
- 0474US7989022B2Methods of processing substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded theretoMICRON TECHNOLOGY INC·Filed 2007·Granted Aug 2, 2011·3 cites·22 claims
- 0569US11011521B2Semiconductor structure patterningMICRON TECHNOLOGY INC·Filed 2019·Granted May 18, 2021·1 cites·21 claims
- 0656US8929052B2Methods of processing semiconductor substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded theretoMICRON TECHNOLOGY INC·Filed 2013·Granted Jan 6, 2015·0 cites·16 claims
- 0752US10020287B2Pass-through interconnect structure for microelectronic dies and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2015·Granted Jul 10, 2018·0 cites·14 claims
- 0843US10964475B2Formation of a capacitor using a sacrificial layerMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 30, 2021·0 cites·24 claims
- 0941US2009029152A1Wafer Bonding Using Nanoparticle MaterialANALOG DEVICES INC·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →