Inventor · disambiguated record
Dennis George Rex
Also filed as: REX DENNIS · REX DENNIS G · REX DENNIS GEORGE
26 granted patents·8 pending applications·343 citations·filing 1996–2024
96Inventor score
Files withCOMPONENT RE ENG COMPANY INC8WATLOW ELECTRIC MFG8COMPONENT RE ENGINEERING COMPANY INC6INSYNC SYSTEMS INC4TALON INNOVATIONS INC3
Top patents by PatentIndex Score
34 records- 0195US5836355ABuilding blocks for integrated gas panelINSYNC SYSTEMS INC·Filed 1996·Granted Nov 17, 1998·148 cites·25 claims
- 0289US11712745B2Semiconductor substrate support with multiple electrodes and method for making sameWATLOW ELECTRIC MFG·Filed 2022·Granted Aug 1, 2023·1 cites·14 claims
- 0389US6302141B1Building blocks for integrated gas panelINSYNC SYSTEMS INC·Filed 1997·Granted Oct 16, 2001·64 cites·99 claims
- 0487US8684256B2Method for hermetically joining plate and shaft devices including ceramic materials used in semiconductor processingCOMPONENT RE ENGINEERING COMPANY INC·Filed 2012·Granted Apr 1, 2014·7 cites·10 claims
- 0586US9624137B2Low temperature method for hermetically joining non-diffusing ceramic materialsCOMPONENT RE-ENGINEERING COMPANY INC·Filed 2014·Granted Apr 18, 2017·6 cites·26 claims
- 0686US8789743B2Hermetically joined ceramic assemblies and low temperature method for hermetically joining ceramic materialsCOMPONENT RE ENGINEERING COMPANY INC·Filed 2012·Granted Jul 29, 2014·5 cites·19 claims
- 0786US6951226B2Shear-resistant modular fluidic blocksTALON INNOVATIONS INC·Filed 2002·Granted Oct 4, 2005·33 cites·20 claims
- 0882US11091397B2Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devicesWATLOW ELECTRIC MFG·Filed 2019·Granted Aug 17, 2021·2 cites·20 claims
- 0980US7789107B2Fluid transport in monolithic structuresTALON INNOVATIONS·Filed 2007·Granted Sep 7, 2010·10 cites·25 claims
- 1077US8932690B2Plate and shaft deviceELLIOT ALFRED GRANT·Filed 2012·Granted Jan 13, 2015·4 cites·13 claims
- 1174US10646941B2Method for manufacture of a multi-layer plate deviceCOMPONENT RE ENG COMPANY INC·Filed 2017·Granted May 12, 2020·1 cites·16 claims
- 1273US11993547B2Termination feedthrough unit with ceramic insulator for vacuum and corrosive applicationsWATLOW ELECTRIC MFG·Filed 2021·Granted May 28, 2024·0 cites·20 claims
- 1370US9984866B2Multiple zone heaterCOMPONENT RE ENG COMPANY INC·Filed 2013·Granted May 29, 2018·2 cites·7 claims
- 1469US9556074B2Method for manufacture of a multi-layer plate deviceCOMPONENT RE-ENGINEERING COMPANY INC·Filed 2012·Granted Jan 31, 2017·1 cites·23 claims
- 1569US9315424B2Multi-layer plate deviceCOMPONENT RE ENGINEERING COMPANY INC·Filed 2012·Granted Apr 19, 2016·1 cites·19 claims
- 1667US10153183B2High speed low temperature method for manufacturing and repairing semiconductor processing equipment and equipment produced using sameCOMPONENT RE ENG COMPANY INC·Filed 2014·Granted Dec 11, 2018·1 cites·10 claims
- 1764US7150475B2Shear-resistant modular fluidic blocksTALON INNOVATIONS INC·Filed 2002·Granted Dec 19, 2006·16 cites·8 claims
- 1863US7896031B2Fluid transport in monolithic structuresTALON INNOVATIONS·Filed 2010·Granted Mar 1, 2011·2 cites·5 claims
- 1962US6158454ASieve like structure for fluid flow through structural arrangementINSYNC SYSTEMS INC·Filed 1998·Granted Dec 12, 2000·21 cites·58 claims
- 2062US2025069943A1Hybrid shaft assembly for thermal control in heated semiconductor pedestalsWATLOW ELECTRIC MFG·Filed 2024·Application pending·0 cites
- 2161US10991616B2High speed low temperature method for manufacturing and repairing semiconductor processing equipment and equipment produced using sameCOMPONENT RE ENG COMPANY INC·Filed 2018·Granted Apr 27, 2021·0 cites·7 claims
- 2261US2024404869A1Solid-state bonding method for the manufacture of semiconductor chucks and heatersWATLOW ELECTRIC MFG·Filed 2024·Application pending·0 cites
- 2357US11823890B2Multiple zone heaterWATLOW ELECTRIC MFG·Filed 2022·Granted Nov 21, 2023·0 cites·20 claims
- 2457US10213858B2Multi-layer plate deviceCOMPONENT RE ENG COMPANY INC·Filed 2016·Granted Feb 26, 2019·0 cites·15 claims
- 2555US10287215B2Low temperature method for hermetically joining non-diffusing ceramic materials in multi-layer plate devicesCOMPONENT RE ENG COMPANY INC·Filed 2017·Granted May 14, 2019·0 cites·14 claims
- 2654US11495450B2Multiple zone heaterWATLOW ELECTRIC MFG·Filed 2018·Granted Nov 8, 2022·0 cites·16 claims
- 2753US6231260B1Mounting plane for integrated gas panelINSYNC SYSTEMS INC·Filed 1997·Granted May 15, 2001·18 cites·29 claims
- 2852US2019066980A1Ceramic Material Assembly For Use In Highly Corrosive Or Erosive Semiconductor Processing ApplicationsCOMPONENT RE ENG COMPANY INC·Filed 2018·Application pending·0 cites
- 2949US11028021B2Termination feedthrough unit with ceramic insulator suitable for vacuum and corrosive applicationsWATLOW ELECTRIC MFG·Filed 2018·Granted Jun 8, 2021·0 cites·16 claims
- 3047US2010177454A1Electrostatic chuck with dielectric insertsCOMPONENT RE ENGINEERING COMPA·Filed 2009·Application pending·0 cites
- 3147US2018354861A1Ceramic Material Assembly For Use In Highly Corrosive Or Erosive Industrial ApplicationsCOMPONENT RE ENG COMPANY INC·Filed 2018·Application pending·0 cites
- 3243US2014014710A1Method For Hermetically Joining Ceramic Materials Using Brazing Of Pre-Metallized RegionsCOMPONENT RE ENGINEERING COMPNAY INC·Filed 2013·Application pending·0 cites
- 3340US2013250471A1Compressible conductive element for use in current-carrying structureCOMPONENT RE ENGINEERING COMPANY INC·Filed 2013·Application pending·0 cites
- 3439US2006027275A1Shear-resistant modular fluidic blocksTALON INNOVATIONS INC·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →