Inventor · disambiguated record
Devika Sil
Also filed as: SIL DEVIKA
6 granted patents·2 pending applications·9 citations·filing 2019–2020
71Inventor score
Files withIBM8
Top patents by PatentIndex Score
8 records- 0190US11309216B2Large grain copper interconnect lines for MRAMIBM·Filed 2020·Granted Apr 19, 2022·3 cites·15 claims
- 0288US11114606B2MRAM devices containing a harden gap fill dielectric materialIBM·Filed 2019·Granted Sep 7, 2021·6 cites·18 claims
- 0350US11302637B2Interconnects including dual-metal viasIBM·Filed 2020·Granted Apr 12, 2022·0 cites·12 claims
- 0448US11756786B2Forming high carbon content flowable dielectric film with low processing damageIBM·Filed 2019·Granted Sep 12, 2023·0 cites·14 claims
- 0548US10978342B2Interconnect with self-forming wrap-all-around barrier layerIBM·Filed 2019·Granted Apr 13, 2021·0 cites·9 claims
- 0645US12272545B2Embedded metal contamination removal from BEOL wafersIBM·Filed 2020·Granted Apr 8, 2025·0 cites·16 claims
- 0741US2020388488A1Bottom-up curing of dielectric films in integrated circuitsIBM·Filed 2019·Application pending·0 cites
- 0841US2020388531A1Ion implantation assisted curing for flowable porous dielectricsIBM·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →