Inventor · disambiguated record
Deepak Swamy
Also filed as: SWAMY DEEPAK · SWAMY DEEPAK N
21 granted patents·3 pending applications·1,029 citations·filing 1992–2023
97Inventor score
Files withDELL USA LP16TATA CONSULTANCY SERVICES LTD3BOSSANOVA SYSTEMS INC1DELL COMPUTER CORP1SUPERCOMPUTER SYSTEMS LTD1
Top patents by PatentIndex Score
24 records- 0194US5400220AMechanical printed circuit board and ball grid array interconnect apparatusDELL USA LP·Filed 1994·Granted Mar 21, 1995·101 cites·23 claims
- 0293US10216485B2Computer platform for development and deployment of sensor data based applications and servicesTATA CONSULTANCY SERVICES LTD·Filed 2012·Granted Feb 26, 2019·77 cites·22 claims
- 0392US5576519AAnisotropic interconnect methodology for cost effective manufacture of high density printed wiring boardsDELL USA LP·Filed 1995·Granted Nov 19, 1996·79 cites·5 claims
- 0489US5593322ALeadless high density connectorDELL USA LP·Filed 1995·Granted Jan 14, 1997·115 cites·19 claims
- 0585US5463191ACircuit board having an improved fine pitch ball grid array and method of assembly thereforDELL USA LP·Filed 1994·Granted Oct 31, 1995·57 cites·25 claims
- 0684US5451720ACircuit board thermal relief pattern having improved electrical and EMI characteristicsDELL USA LP·Filed 1994·Granted Sep 19, 1995·59 cites·20 claims
- 0784US5276955AMultilayer interconnect system for an area array interconnection using solid state diffusionSUPERCOMPUTER SYSTEMS LTD·Filed 1992·Granted Jan 11, 1994·99 cites·29 claims
- 0883US5456004AAnisotropic interconnect methodology for cost effective manufacture of high density printed circuit boardsDELL USA LP·Filed 1994·Granted Oct 10, 1995·44 cites·10 claims
- 0982US5625227ACircuit board-mounted IC package cooling apparatusDELL USA LP·Filed 1995·Granted Apr 29, 1997·60 cites·17 claims
- 1081US5424492AOptimal PCB routing methodology for high I/O density interconnect devicesDELL USA LP·Filed 1994·Granted Jun 13, 1995·77 cites·12 claims
- 1179US5459287ASocketed printed circuit board BGA connection apparatus and associated methodsDELL USA LP·Filed 1994·Granted Oct 17, 1995·64 cites·8 claims
- 1269US5623594AEmbedded thermistor for on-board thermal monitoring of electrical componentsDELL USA LP·Filed 1996·Granted Apr 22, 1997·55 cites·27 claims
- 1367US5567295AMethod and apparatus for making staggered blade edge connectorsDELL USA LP·Filed 1994·Granted Oct 22, 1996·28 cites·11 claims
- 1466US9990182B2Computer platform for development and deployment of sensor-driven vehicle telemetry applications and servicesTATA CONSULTANCY SERVICES LTD·Filed 2012·Granted Jun 5, 2018·2 cites·18 claims
- 1564US5392980AMethod and apparatus for reworking ball grid array packages to allow reuse of functional devicesDELL USA LP·Filed 1993·Granted Feb 28, 1995·35 cites·16 claims
- 1661US2023360151A1Self-customizing, multi-tenanted mobile system and method for digitally gathering and disseminating real-time visual intelligence on utility asset damage enabling automated priority analysis and enhanced utility outage responseSWAMY DEEPAK·Filed 2023·Application pending·0 cites
- 1759US11087078B2System and method for real time digitization of hand written input dataTATA CONSULTANCY SERVICES LTD·Filed 2019·Granted Aug 10, 2021·2 cites·18 claims
- 1859US5714789ACircuit board-mounted IC package cooling apparatusDELL USA LP·Filed 1996·Granted Feb 3, 1998·20 cites·2 claims
- 1956US5946544ACircuit board-mounted IC package cooling and methodDELL USA LP·Filed 1996·Granted Aug 31, 1999·18 cites·3 claims
- 2047US5835357ACeramic integrated circuit package with optional IC removably mounted theretoDELL USA LP·Filed 1995·Granted Nov 10, 1998·14 cites·10 claims
- 2143US5987553AAdaptor board interconnection for a processor board and motherboardDELL COMPUTER CORP·Filed 1997·Granted Nov 16, 1999·15 cites·8 claims
- 2239US2018025458A1Self-customizing, multi-tenanted mobile system and method for digitally gathering and disseminating real-time visual intelligence on utility asset damage enabling automated priority analysis and enhanced utility outage responseBOSSANOVA SYSTEMS INC·Filed 2017·Application pending·0 cites
- 2337US5675183AHybrid multichip module and methods of fabricating sameDELL USA LP·Filed 1995·Granted Oct 7, 1997·8 cites·9 claims
- 2430US2001012726A1Stacked module connectorFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →