Inventor · disambiguated record
Detlef Weber
Also filed as: WEBER DETLEF
15 granted patents·4 pending applications·34 citations·filing 2000–2025
88Inventor score
Files withINFINEON TECHNOLOGIES AG6INFINEON TECHNOLOGIES DRESDEN GMBH2NEUBAUER GEORG2BAIER ULRICH1BUTHMANN HANS-PETER1
Top patents by PatentIndex Score
19 records- 0192US9859418B2Semiconductor device comprising a transistor cell including a source contact in a trench, method for manufacturing the semiconductor device and integrated circuitINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2016·Granted Jan 2, 2018·8 cites·21 claims
- 0264US7785935B2Manufacturing method for forming an integrated circuit device and corresponding integrated circuit deviceQIMONDA AG·Filed 2007·Granted Aug 31, 2010·3 cites·12 claims
- 0362US6277761B1Method for fabricating stacked viasSIEMENS AG·Filed 2000·Granted Aug 21, 2001·14 cites·7 claims
- 0457US8123844B2Plugging resistant mist eliminator for horizontal gas flow built from tubular elements and vane type lamellaBUTHMANN HANS-PETER·Filed 2009·Granted Feb 28, 2012·3 cites·4 claims
- 0554US8800778B2Suspension solution filter sieve basket for use in flue gas desulphurizationNEUBAUER GEORG·Filed 2010·Granted Aug 12, 2014·1 cites·10 claims
- 0653US8002882B2Droplet separator installationMUNTERS EUROFORM GMBH CARL·Filed 2004·Granted Aug 23, 2011·3 cites·14 claims
- 0751US10381475B2Semiconductor device comprising a transistor cell including a source contact in a trench, method for manufacturing the semiconductor device and integrated circuitINFINEON TECHNOLOGIES DRESDEN GMBH·Filed 2017·Granted Aug 13, 2019·0 cites·12 claims
- 0850US2025259929A1Semiconductor device and method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 0949US10903079B2Method for forming complementary doped semiconductor regions in a semiconductor bodyINFINEON TECH DRESDEN GMBH & CO KG·Filed 2019·Granted Jan 26, 2021·0 cites·18 claims
- 1046US9289708B2Tube separator as a separator of very fine particles for reducing fine dust emissions and avoiding stack rainNEUBAUER GEORG·Filed 2011·Granted Mar 22, 2016·0 cites·13 claims
- 1145US11759737B2Modular filter systemWEBER DETLEF·Filed 2018·Granted Sep 19, 2023·0 cites·15 claims
- 1245US8106511B2Reduced-stress through-chip feature and method of making the sameHEDLER HARRY·Filed 2008·Granted Jan 31, 2012·0 cites·24 claims
- 1345US6852628B2Method of insulating interconnects, and memory cell array with insulated interconnectsINFINEON TECHNOLOGIES AG·Filed 2002·Granted Feb 8, 2005·1 cites·8 claims
- 1443US2010099253A1Method for Structuring a Layered StackBAIER ULRICH·Filed 2008·Application pending·0 cites
- 1542US10205016B2Method for manufacturing an integrated circuit including a lateral trench transistor and a logic circuit elementINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 12, 2019·0 cites·20 claims
- 1640US6864170B2Compact semiconductor structureINFINEON TECHNOLOGIES AG·Filed 2001·Granted Mar 8, 2005·1 cites·3 claims
- 1738US2007218629A1Method of fabricating an integrated memory deviceINFINEON TECHNOLOGIES AG·Filed 2006·Application pending·0 cites
- 1834US6908844B2Metallization arrangement for semiconductor structure and corresponding fabrication methodINFINEON TECHNOLOGIES AG·Filed 2001·Granted Jun 21, 2005·0 cites·7 claims
- 1934US2007243708A1Manufacturing method for an integrated semiconductor contact structure having an improved aluminum fillHAHN JENS·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →