Inventor · disambiguated record
Derek B. Workman
Also filed as: WORKMAN DEREK B
9 granted patents·4 pending applications·126 citations·filing 2001–2008
86Inventor score
Top patents by PatentIndex Score
13 records- 0193US6660560B2No-flow underfill material and underfill method for flip chip devicesDELPHI TECH INC·Filed 2001·Granted Dec 9, 2003·77 cites·11 claims
- 0276US7331106B2Underfill methodDELPHI TECH INC·Filed 2006·Granted Feb 19, 2008·11 cites·11 claims
- 0376US6943058B2No-flow underfill process and material thereforDELPHI TECH INC·Filed 2003·Granted Sep 13, 2005·24 cites·20 claims
- 0470US7790814B2Radiopaque polymers for circuit board assemblyDELPHI TECH INC·Filed 2005·Granted Sep 7, 2010·5 cites·19 claims
- 0568US7498197B2Silica nanoparticles thermoset resin compositionsDELPHI TECH INC·Filed 2006·Granted Mar 3, 2009·2 cites·30 claims
- 0661US7754824B2Dendritic polyol, cycloaliphatic epoxy resin and cationic initiatorDELPHI TECH INC·Filed 2008·Granted Jul 13, 2010·0 cites·1 claims
- 0756US7205652B2Electronic assembly including multiple substratesDELPHI TECH INC·Filed 2005·Granted Apr 17, 2007·1 cites·20 claims
- 0853US7119449B2Enhancement of underfill physical properties by the addition of thermotropic celluloseDELPHI TECH INC·Filed 2003·Granted Oct 10, 2006·6 cites·15 claims
- 0944US2006252892A1Hyperbranched polymer and cycloaliphatic epoxy resin thermosetsBASHEER RAFIL A·Filed 2005·Application pending·0 cites
- 1042US2007235217A1Devices with microjetted polymer standoffsWORKMAN DEREK B·Filed 2006·Application pending·0 cites
- 1139US7202571B2Electronic module with form in-place pedestalDELPHI TECH INC·Filed 2004·Granted Apr 10, 2007·0 cites·15 claims
- 1235US2005014313A1Underfill methodFiled 2003·Application pending·0 cites
- 1332US2006199301A1Methods of making a curable composition having low coefficient of thermal expansion and an integrated circuit and a curable composition and integrated circuit made there fromBASHEER RAFIL A·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →