Inventor · disambiguated record
Der-Chyang Yeh
Also filed as: YEH DER-CHYANG
253 granted patents·48 pending applications·7,196 citations·filing 2005–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD261TAIWAN SEMICONDUCTOR MFG16YU CHEN-HUA5YEH DER-CHYANG4CHANG CHUN HUA3
Top patents by PatentIndex Score
301 records- 0199US11721559B2Integrated circuit package pad and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 8, 2023·4 cites·20 claims
- 0299US11508695B2Redistribution layers in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 22, 2022·7 cites·20 claims
- 0399US10658337B2Packages and packaging methods for semiconductor devices, and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 19, 2020·37 cites·20 claims
- 0499US10062648B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 28, 2018·70 cites·19 claims
- 0599US10037963B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 31, 2018·56 cites·20 claims
- 0699US9997464B2Dummy features in redistribution layers (RDLS) and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 12, 2018·64 cites·20 claims
- 0799US9812337B2Integrated circuit package pad and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 7, 2017·66 cites·20 claims
- 0899US9768133B1Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 19, 2017·45 cites·20 claims
- 0999US9741690B1Redistribution layers in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 22, 2017·52 cites·20 claims
- 1099US9653433B2Multi-chip structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 16, 2017·38 cites·20 claims
- 1199US9263511B2Package with metal-insulator-metal capacitor and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 16, 2016·1k cites·20 claims
- 1299US9111949B2Methods and apparatus of wafer level package for heterogeneous integration technologyYU CHEN-HUA·Filed 2012·Granted Aug 18, 2015·1k cites·20 claims
- 1399US9048222B2Method of fabricating interconnect structure for package-on-package devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 2, 2015·1.1k cites·20 claims
- 1499US8993380B2Structure and method for 3D IC packageTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 31, 2015·900 cites·22 claims
- 1599US8803306B1Fan-out package structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 12, 2014·599 cites·20 claims
- 1699US8680647B2Packages with passive devices and methods of forming the sameYU CHEN-HUA·Filed 2012·Granted Mar 25, 2014·594 cites·20 claims
- 1798US11581250B2Package with metal-insulator-metal capacitor and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 14, 2023·4 cites·20 claims
- 1898US11482497B2Package structure including a first die and a second die and a bridge die and method of forming the package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 25, 2022·7 cites·20 claims
- 1998US10347606B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 9, 2019·19 cites·20 claims
- 2098US10163803B1Integrated fan-out packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·42 cites·20 claims
- 2198US9461025B2Electric magnetic shielding structure in packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 4, 2016·48 cites·20 claims
- 2298US9460987B2Interconnect structure for package-on-package devices and a method of fabricatingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 4, 2016·22 cites·20 claims
- 2398US9373527B2Chip on package structure and methodTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 21, 2016·46 cites·20 claims
- 2498US9324698B2Multi-chip structure and method of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Apr 26, 2016·29 cites·20 claims
- 2598US9196586B2Semiconductor package including an embedded surface mount device and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Nov 24, 2015·52 cites·20 claims
- 2698US8809996B2Package with passive devices and method of forming the sameCHEN SHUO-MAO·Filed 2012·Granted Aug 19, 2014·578 cites·19 claims
- 2797US12170207B2Stacked semiconductor devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 17, 2024·2 cites·20 claims
- 2897US12033949B2Package structure with bridge die laterally wrapped by insulating encapsulant and surrounded by through vias and method of forming the package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 9, 2024·3 cites·20 claims
- 2997US11961800B2Via for semiconductor device connection and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 16, 2024·2 cites·20 claims
- 3097US11842983B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 12, 2023·3 cites·20 claims
- 3197US11251071B2Raised via for terminal connections on different planesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 15, 2022·4 cites·20 claims
- 3297US10811394B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 20, 2020·10 cites·20 claims
- 3397US9922903B2Interconnect structure for package-on-package devices and a method of fabricatingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 20, 2018·12 cites·20 claims
- 3497US9620482B1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 11, 2017·19 cites·17 claims
- 3596US12062602B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 13, 2024·3 cites·20 claims
- 3696US10879224B2Package structure, die and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·15 cites·20 claims
- 3796US10475768B2Redistribution layers in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 12, 2019·11 cites·20 claims
- 3896US10157852B2Multi-stacked package-on-package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 18, 2018·9 cites·20 claims
- 3996US10026704B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 17, 2018·10 cites·20 claims
- 4096US9666522B2Alignment mark design for packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 30, 2017·20 cites·20 claims
- 4196US9646955B2Packages and methods of forming packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 9, 2017·16 cites·20 claims
- 4296US9502343B1Dummy metal with zigzagged edgesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 22, 2016·14 cites·20 claims
- 4395US11587900B2Package structure including IPD and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 21, 2023·3 cites·20 claims
- 4495US10269619B2Wafer level chip scale packaging intermediate structure apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Apr 23, 2019·15 cites·20 claims
- 4595US10157899B2Packages and methods of forming packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·9 cites·20 claims
- 4695US9984998B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 29, 2018·9 cites·20 claims
- 4795US9911672B1Semiconductor devices, method for fabricating integrated fan-out packages, and method for fabricating semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 6, 2018·22 cites·17 claims
- 4895US8810006B2Interposer system and methodYU CHEN-HUA·Filed 2012·Granted Aug 19, 2014·20 cites·20 claims
- 4994US12327819B2Devices employing thermal and mechanical enhanced layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 10, 2025·1 cites·20 claims
- 5094US11854994B2Redistribution structure for integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·2 cites·20 claims
Showing the top 50 of 301 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →