Inventor · disambiguated record
Dian-Hau Chen
Also filed as: CHEN DIAN-HAU
129 granted patents·108 pending applications·883 citations·filing 1999–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD205TAIWAN SEMICONDUCTOR MFG20LU LEE-CHUNG3CHEN CHII-PING1FU CHUNG-MIN1
Top patents by PatentIndex Score
237 records- 0198US12230566B2Metal-insulator-metal structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 18, 2025·3 cites·20 claims
- 0298US11114373B1Metal-insulator-metal structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 7, 2021·9 cites·20 claims
- 0397US11950432B2Semiconductor packages and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 2, 2024·3 cites·20 claims
- 0497US8999839B2Semiconductor structure having an air-gap region and a method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 7, 2015·187 cites·20 claims
- 0596US11842959B2Metal-Insulator-Metal structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 12, 2023·2 cites·20 claims
- 0696US11424319B2Multilayer capacitor electrodeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 23, 2022·3 cites·20 claims
- 0796US9099530B2Methods of patterning small via pitch dimensionsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Aug 4, 2015·108 cites·20 claims
- 0895US11728262B2Metal plate corner structure on metal insulator metalTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 15, 2023·3 cites·20 claims
- 0995US9653348B1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 16, 2017·23 cites·20 claims
- 1094US12191248B2Semiconductor arrangement and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 7, 2025·2 cites·20 claims
- 1194US11705384B2Through vias of semiconductor structure and method of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 18, 2023·2 cites·20 claims
- 1294US10361152B2Semiconductor structure having an air-gap region and a method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 23, 2019·11 cites·20 claims
- 1394US8728332B2Methods of patterning small via pitch dimensionsLIN CHUNG-YI·Filed 2012·Granted May 20, 2014·152 cites·19 claims
- 1494US8119310B1Mask-shift-aware RC extraction for double patterning designLU LEE-CHUNG·Filed 2010·Granted Feb 21, 2012·11 cites·20 claims
- 1593US11145564B2Multi-layer passivation structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 12, 2021·9 cites·20 claims
- 1693US9543193B2Non-hierarchical metal layers for integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 10, 2017·8 cites·20 claims
- 1792US11961880B2Metal-insulator-metal structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 16, 2024·2 cites·20 claims
- 1892US11437331B2Chip structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 6, 2022·6 cites·20 claims
- 1992US11342408B2Metal-insulator-metal structure and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·2 cites·20 claims
- 2092US6667230B2Passivation and planarization process for flip chip packagesTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Dec 23, 2003·71 cites·26 claims
- 2191US11728375B2Metal-insulator-metal (MIM) capacitor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 15, 2023·1 cites·20 claims
- 2291US11716910B2MRAM structure for balanced loadingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 1, 2023·2 cites·20 claims
- 2391US11670608B2Prevention of metal pad corrosion due to exposure to halogenTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 6, 2023·2 cites·20 claims
- 2491US8456009B2Semiconductor structure having an air-gap region and a method of manufacturing the sameSU SHU-HUI·Filed 2010·Granted Jun 4, 2013·19 cites·20 claims
- 2591US8304906B2Partial air gap formation for providing interconnect isolation in integrated circuitsHUANG CHENG-LIN·Filed 2010·Granted Nov 6, 2012·19 cites·20 claims
- 2691US2025364457A1Chip structure with conductive layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2789US9117882B2Non-hierarchical metal layers for integrated circuitsLU LEE-CHUNG·Filed 2011·Granted Aug 25, 2015·8 cites·20 claims
- 2888US10861810B2Shielding structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 8, 2020·5 cites·20 claims
- 2987US12494422B2Semiconductor structure and method for forming the semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 9, 2025·1 cites·20 claims
- 3086US12477756B2Metal-insulator-metal structure and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 18, 2025·0 cites·20 claims
- 3186US10157843B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·3 cites·20 claims
- 3286US9852992B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 26, 2017·3 cites·20 claims
- 3386US6316351B1Inter-metal dielectric film composition for dual damascene processTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Nov 13, 2001·43 cites·21 claims
- 3486US2025301663A1Semiconductor devices and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3585US12406952B2Chip structure with conductive layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 2, 2025·0 cites·20 claims
- 3685US2025336428A1Structure and Method for MRAM Devices with a Slot ViaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3784US12432933B2Semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 30, 2025·0 cites·20 claims
- 3884US11715756B2Device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 1, 2023·1 cites·20 claims
- 3984US11688759B2Metal-insulator-metal capacitive structure and methods of fabricating thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 27, 2023·1 cites·20 claims
- 4084US10879179B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 29, 2020·2 cites·20 claims
- 4184US10734474B2Metal-insulator-metal structure and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 4, 2020·2 cites·19 claims
- 4284US9881870B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 30, 2018·3 cites·20 claims
- 4384US2025357392A1Reduction of cracks in passivation layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4484US2025338506A1Semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4583US12201031B2Structure and method for MRAM devices having spacer elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
- 4683US11996356B2Low-stress passivation layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 28, 2024·0 cites·20 claims
- 4783US11081445B2Semiconductor device comprising air gaps having different configurationsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 3, 2021·2 cites·20 claims
- 4883US8975749B2Method of making a semiconductor device including barrier layers for copper interconnectTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 10, 2015·5 cites·20 claims
- 4983US6468904B1RPO process for selective CoSix formationTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Oct 22, 2002·41 cites·23 claims
- 5083US2024312885A1Low-stress passivation layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
Showing the top 50 of 237 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →