Inventor · disambiguated record
Didier Cottet
Also filed as: COTTET DIDIER
12 granted patents·5 pending applications·45 citations·filing 2010–2021
86Inventor score
Files withABB SCHWEIZ AG4ABB RESEARCH LTD3COTTET DIDIER3HITACHI ENERGY SWITZERLAND AG3ABB TECHNOLOGY AG2
Top patents by PatentIndex Score
17 records- 0191US9113579B2Cabinet with modules having a thermosiphon cooler arrangementABB TECHNOLOGY AG·Filed 2012·Granted Aug 18, 2015·16 cites·34 claims
- 0290US9113578B2Thermosiphon cooler arrangement in modules with electric and/or electronic componentsABB TECHNOLOGY AG·Filed 2012·Granted Aug 18, 2015·13 cites·26 claims
- 0382US10056943B2System for transmitting and receiving a power line communication signal over the power bus of a power electronic converterABB RESEARCH LTD·Filed 2016·Granted Aug 21, 2018·5 cites·14 claims
- 0481US10283436B2Power electronics module with first and second coolersABB SCHWEIZ AG·Filed 2017·Granted May 7, 2019·4 cites·20 claims
- 0581US9899283B2Power module with low stray inductanceABB SCHWEIZ AG·Filed 2017·Granted Feb 20, 2018·4 cites·20 claims
- 0677US11018109B2Power semiconductor module with low gate path inductanceABB SCHWEIZ AG·Filed 2019·Granted May 25, 2021·3 cites·27 claims
- 0750US11695331B2Converter arrangementHITACHI ENERGY SWITZERLAND AG·Filed 2019·Granted Jul 4, 2023·0 cites·20 claims
- 0846US2024030101A1Power Module and Method for Producing a Power ModuleHITACHI ENERGY SWITZERLAND AG·Filed 2021·Application pending·0 cites
- 0942US11742312B2Hybrid short circuit failure mode preform for power semiconductor devicesHITACHI ENERGY SWITZERLAND AG·Filed 2019·Granted Aug 29, 2023·0 cites·21 claims
- 1041US9607924B2Power semiconductor module and method for cooling power semiconductor moduleABB TECHNOLOGY OY·Filed 2015·Granted Mar 28, 2017·0 cites·5 claims
- 1139US10224424B2Semiconductor module with two auxiliary emitter conductor pathsABB SCHWEIZ AG·Filed 2016·Granted Mar 5, 2019·0 cites·20 claims
- 1239US2014050488A1Communication system for power electronic convertersABB RESEARCH LTD·Filed 2013·Application pending·0 cites
- 1336US2011013366A1Electronic circuit board with a thermal capacitorABB RESEARCH LTD·Filed 2010·Application pending·0 cites
- 1433US9024421B2Connection arrangement for semiconductor power modulesCOTTET DIDIER·Filed 2011·Granted May 5, 2015·0 cites·24 claims
- 1532US2016079156A1Power semiconductor module and method of manufacturing the sameABB TECHNOLOGY OY·Filed 2015·Application pending·0 cites
- 1631US2012139483A1Composite capacitance and use thereofCOTTET DIDIER·Filed 2012·Application pending·0 cites
- 1729US8519433B2Semiconductor switching device with gate connectionCOTTET DIDIER·Filed 2010·Granted Aug 27, 2013·0 cites·30 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →