Inventor · disambiguated record
Dibyajat Mishra
Also filed as: MISHRA DIBYAJAT
3 granted patents·4 pending applications·2 citations·filing 2012–2022
53Inventor score
Top patents by PatentIndex Score
7 records- 0176US10763231B2Bump bond structure for enhanced electromigration performanceTEXAS INSTRUMENTS INC·Filed 2018·Granted Sep 1, 2020·2 cites·12 claims
- 0270US12463158B2Microelectronic device package with integral antenna module and semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2022·Granted Nov 4, 2025·0 cites·19 claims
- 0362US11450638B2Bump bond structure for enhanced electromigration performanceTEXAS INSTRUMENTS INC·Filed 2020·Granted Sep 20, 2022·0 cites·15 claims
- 0447US2024145363A1Fan-out package having ball grid array substrate with signal and power metallizationTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 0542US2014347157A1Magnetic device utilizing nanocomposite films layered with adhesivesGEORGIA TECH RES INST·Filed 2012·Application pending·0 cites
- 0641US2020135632A1Die isolation on a substrateTEXAS INSTRUMENTS INC·Filed 2018·Application pending·0 cites
- 0735US2020235067A1Electronic device flip chip package with exposed clipTEXAS INSTRUMENTS INC·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →