Inventor · disambiguated record
Diana M. Schonauer
Also filed as: SCHONAUER DIANA · SCHONAUER DIANA M · SCHONAUER DIANA MARIE
19 granted patents·1,346 citations·filing 1995–2002
96Inventor score
Files withADVANCED MICRO DEVICES INC19
Top patents by PatentIndex Score
19 records- 0198US6528409B1Interconnect structure formed in porous dielectric material with minimized degradation and electromigrationADVANCED MICRO DEVICES INC·Filed 2002·Granted Mar 4, 2003·624 cites·67 claims
- 0291US5916855AChemical-mechanical polishing slurry formulation and method for tungsten and titanium thin filmsADVANCED MICRO DEVICES INC·Filed 1997·Granted Jun 29, 1999·110 cites·53 claims
- 0390US5662769AChemical solutions for removing metal-compound contaminants from wafers after CMP and the method of wafer cleaningADVANCED MICRO DEVICES INC·Filed 1995·Granted Sep 2, 1997·107 cites·13 claims
- 0488US6720264B2Prevention of precipitation defects on copper interconnects during CMP by use of solutions containing organic compounds with silica adsorption and copper corrosion inhibiting propertiesADVANCED MICRO DEVICES INC·Filed 2000·Granted Apr 13, 2004·45 cites·15 claims
- 0587US6433402B1Selective copper alloy depositionADVANCED MICRO DEVICES INC·Filed 2000·Granted Aug 13, 2002·47 cites·6 claims
- 0684US6074949AMethod of preventing copper dendrite formation and growthADVANCED MICRO DEVICES INC·Filed 1998·Granted Jun 13, 2000·72 cites·20 claims
- 0782US6503418B2Ta barrier slurry containing an organic additiveADVANCED MICRO DEVICES INC·Filed 1999·Granted Jan 7, 2003·52 cites·51 claims
- 0879US6218290B1Copper dendrite prevention by chemical removal of dielectricADVANCED MICRO DEVICES INC·Filed 1998·Granted Apr 17, 2001·56 cites·18 claims
- 0974US6140239AChemically removable Cu CMP slurry abrasiveADVANCED MICRO DEVICES INC·Filed 1998·Granted Oct 31, 2000·44 cites·10 claims
- 1066US5702563AReduced chemical-mechanical polishing particulate contaminationADVANCED MICRO DEVICES INC·Filed 1995·Granted Dec 30, 1997·37 cites·35 claims
- 1160US6169034B1Chemically removable Cu CMP slurry abrasiveADVANCED MICRO DEVICES INC·Filed 1998·Granted Jan 2, 2001·23 cites·15 claims
- 1258US6596637B1Chemically preventing Cu dendrite formation and growth by immersionADVANCED MICRO DEVICES INC·Filed 1998·Granted Jul 22, 2003·22 cites·22 claims
- 1357US6319833B1Chemically preventing copper dendrite formation and growth by sprayingADVANCED MICRO DEVICES INC·Filed 1998·Granted Nov 20, 2001·21 cites·21 claims
- 1454US6207569B1Prevention of Cu dendrite formation and growthADVANCED MICRO DEVICES INC·Filed 1998·Granted Mar 27, 2001·18 cites·19 claims
- 1552US6177349B1Preventing Cu dendrite formation and growthADVANCED MICRO DEVICES INC·Filed 1998·Granted Jan 23, 2001·17 cites·18 claims
- 1651US6197690B1Chemically preventing Cu dendrite formation and growth by double sided scrubbingADVANCED MICRO DEVICES INC·Filed 1998·Granted Mar 6, 2001·16 cites·30 claims
- 1748US6162727AChemical treatment for preventing copper dendrite formation and growthADVANCED MICRO DEVICES INC·Filed 1998·Granted Dec 19, 2000·14 cites·31 claims
- 1844US6153933AElimination of residual materials in a multiple-layer interconnect structureADVANCED MICRO DEVICES INC·Filed 1997·Granted Nov 28, 2000·13 cites·12 claims
- 1941US5936307ASurface modification method for film stress reductionADVANCED MICRO DEVICES INC·Filed 1997·Granted Aug 10, 1999·8 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →